The Design Automation Chips to Systems Conference is the preeminent international event for professionals involved in electronic design, system architecture, and EDA. Formerly known simply as the Design Automation Conference or DAC has evolved over more than six decades into a forward-looking forum that spans the entire… Read More
Author: Daniel Nenni
DAC – The Chips to Systems Conference 2026
CEO Interview with Naama BAK of Understand Tech
Naama BAK is an entrepreneur with 15 years of experience in tech. He is the founder of Understand Tech, a generative AI platform for enterprises, and Trustii.io, a machine learning platform for data science challenges. He previously held roles at NXP Semiconductors, Orange, and Safran, working in cybersecurity across research,… Read More
CEO Interview with Echo Yang of CSCERAMIC
Echo Yang is the CEO of CSCERAMIC, a China-based manufacturer specializing in advanced ceramic materials and precision ceramic components for industrial and laboratory applications. With a background spanning international trade, manufacturing coordination, and engineering-driven supply chain development, Echo leads… Read More
Synopsys and AMD Honored for Generative and Agentic AI Vision, Leadership, and Impact
Synopsys and AMD were recently selected by the World Economic Forum for inclusion in the WEF’s MINDS (Meaningful, Intelligent, Novel, Deployable Solutions) AI program, recognizing their leadership and real-world impact in applying generative and agentic AI to semiconductor design and engineering. This distinction places… Read More
2026 Outlook with Mathew Burns of Samtec
We have been working with Matt and Samantec for the past 5 years. Samtec is a billion dollar privately-held manufacturer with a wide range of electronic interconnect products that are critical in high-speed and high-reliability systems.
Matt has been with Samtec for more than 10 very important year developing go-to-market strategies… Read More
The Chronicle of TSMC CoWoS
As semiconductor scaling slowed and system performance became increasingly constrained by data movement rather than raw compute, advanced packaging emerged as a decisive lever. Among these technologies, TSMC’s CoWoS (Chip-on-Wafer-on-Substrate) represents a turning point in how high-performance systems are … Read More
2026 Outlook with Shelly Henry of MooresLabAI
Tell us a little bit about yourself and your company.
I’m Shelly Henry, CEO and co-founder of MooresLabAI. After two decades of building chips for Xbox, HoloLens, and Azure, I reached a point where I knew the industry needed a reset. So I teamed up with fellow engineers, Shashank Chaurasia and Sirish Munipalli to create MooresLabAI—a… Read More
Weebit Nano Reports on 2025 Targets
In early January 2026, Weebit Nano Ltd. (ASX: WBT) released a comprehensive report detailing its performance against the 2025 commercial and technical targets the company had set at its 2024 Annual General Meeting. The announcement highlighted significant progress in both business development and technology qualification,… Read More
2026 Outlook with Steve Roddy of Quadric
Tell us a little bit about yourself and your company.
I am the Chief Marketing Officer at Quadric, where I have spent the past four years helping scale the company’s market presence and customer engagement. Quadric is a pure-play IP licensing company that has been operating for more than seven years. We specialize in a truly unique,… Read More
SiFive to Power Next-Gen RISC-V AI Data Centers with NVIDIA NVLink Fusion
In a strategic move that could reshape the future of AI data center design, SiFive, a leading developer of RISC-V processor IP and compute subsystems, has announced plans to integrate NVIDIA’s NVLink Fusion interconnect technology into its high-performance data center platforms. This collaboration bridges the open-architecture… Read More
CEO Interview with Jerome Paye of TAU Systems