The paper highlights how Fully Depleted Silicon-On-Insulator (FD-SOI) technology provides a robust defense against Laser Fault Injection (LFI), a precise, laboratory-grade attack method that can compromise cryptographic and safety-critical hardware. As vehicles become increasingly digital and connected, with dozens… Read More
Author: Daniel Nenni
FD-SOI: A Cyber-Resilient Substrate for Secure Automotive Electronics
ASU Silvaco Device TCAD Workshop: From Fundamentals to Applications
The ASU-Silvaco Device Technology Computer-Aided Design Workshop is a pivotal educational and professional development event designed to bridge the gap between theoretical semiconductor physics and practical device engineering. Hosted by Arizona State University in collaboration with Silvaco, a leading provider of … Read More
CMOS 2.0 is Advancing Semiconductor Scaling
In the rapidly evolving landscape of semiconductor technology, imec’s recent breakthroughs in wafer-to-wafer hybrid bonding and backside connectivity are paving the way for CMOS 2.0, a paradigm shift in chip design. Introduced in 2024, CMOS 2.0 addresses the limitations of traditional CMOS scaling by partitioning… Read More
CEO Interview with Dr. Bernie Malouin Founder of JetCool and VP of Flex Liquid Cooling
Bernie Malouin is a technical professional with demonstrated experience from concept studies through system deployment. He has a strong track record working in dynamic environments, from highly complex, multi-million dollar development programs to deeply technical research projects. He founded JetCool Technologies … Read More
WEBINAR: Design and Stability Analysis of GaN Power Amplifiers using Advanced Simulation Tools
Why should high frequency circuit designers consider stability early in the design process? Isn’t there enough to worry about just making the circuit function at the fundamental frequency?
In the past, Microwave Engineers used to solve stability problems in the lab, perhaps adding bypassing or loss in a strategic location to… Read More
The 2025 Semi Industry Forum: On the Road to a $1 Trillion Industry
The global semiconductor industry stands at a defining moment in its history. Having surpassed $600 billion in annual revenue, the path to a $1 trillion market is no longer a distant dream but an achievable milestone within the next decade. The annual 2025 Semi Industry Forum, organized by Silicon Catalyst, brings together the… Read More
Selling the Forges of the Future: U.S. Report Exposes China’s Reliance on Western Chip Tools
The U.S. House Select Committee on the Strategic Competition Between the United States and the Chinese Communist Party released a bombshell report titled “Selling the Forges of the Future” on October 7, 2025, detailing how the People’s Republic of China is stockpiling semiconductor manufacturing equipment… Read More
Exploring TSMC’s OIP Ecosystem Benefits
Now that the dust has settled let’s talk more about TSMC’s Open Innovation Platform. Launched in 2008, OIP represents a groundbreaking collaborative model in the semiconductor industry. Unlike IDMs that controlled the entire supply chain, OIP fosters an “open horizontal” ecosystem uniting TSMC… Read More
The RISC-V Revolution: Insights from the 2025 Summits and Andes Technology’s Pivotal Role
RISC-V has emerged as a cornerstone of modern computing, offering an open-source alternative to proprietary designs like ARM and x86. Free from licensing fees and highly extensible, RISC-V powers everything from IoT devices to AI accelerators, with over 13 billion cores shipped globally. Annual RISC-V Summits, organized… Read More
Breaking the Thermal Wall: TSMC Demonstrates Direct-to-Silicon Liquid Cooling on CoWoS®
In a landmark presentation at the 2025 IEEE Electronic Components and Technology Conference (ECTC), TSMC unveiled a groundbreaking advancement in thermal management: Direct-to-Silicon Liquid Cooling integrated directly onto its CoWoS® platform. This innovation, detailed in the paper “Direct-to-Silicon Liquid… Read More
Jensen Huang Drops Donald Trump Truth Bomb on Joe Rogan Podcast