Ansys’ Emergence as a Tier 1 EDA Player— and What That Means for 3D-IC

Ansys’ Emergence as a Tier 1 EDA Player— and What That Means for 3D-IC
by Daniel Nenni on 09-20-2022 at 10:00 am

Ansys chip package board

Over its 40+ year history, electronic design automation (EDA) has seen many companies rise, fall, and merge. In the beginning, in the 1980s, the industry was dominated by what came to be known as the big three — Daisy Systems, Mentor Graphics, and Valid Logic (the infamous “DMV”). The Big 3 has morphed over the years, eventually settling… Read More


WEBINAR: O-RAN Fronthaul Transport Security using MACsec

WEBINAR: O-RAN Fronthaul Transport Security using MACsec
by Daniel Nenni on 09-19-2022 at 10:00 am

Commcore OMAC Webinar

5G provides a range of improvements compared to existing 4G LTE mobile networks in regards to capacity, speed, latency and security. One of the main improvements is in the 5G RAN; it is based on a virtualized architecture where functions can be centralized close to the 5G core for economy or distributed as close to the edge as possible… Read More


Samsung Foundry Forum & SAFE™ Forum 2022

Samsung Foundry Forum & SAFE™ Forum 2022
by Daniel Nenni on 09-16-2022 at 6:00 am

SFF SAFE GLOBAL Banner 400 400

It has been an exciting time in the semiconductor industry and the excitement is far from over. Years 2022 and 2023 will be more challenging in many different ways and live activities have just begun. The cornerstones to the semiconductor industry are the foundries so I look forward to the live foundry events coming up in October,… Read More


WEBINAR: Unlock your Chips’ Full Data Transfer Potential with Interlaken

WEBINAR: Unlock your Chips’ Full Data Transfer Potential with Interlaken
by Daniel Nenni on 09-12-2022 at 6:00 am

Interlaken Blog Post Graphic

Way back in the early 2000s when XAUI was falling short on link flexibility a search for an alternative chip-to-chip data transfer interface with SPI like features lead Cisco Systems and Cortina System to put forward the proposal for the Interlaken standard. The new standard married the best of XAUI’s serialized data and SPI’s … Read More


CEO Interview: Jan Peter Berns from Hyperstone

CEO Interview: Jan Peter Berns from Hyperstone
by Daniel Nenni on 09-09-2022 at 6:00 am

DSCF07001

Since 2012, Dr. Jan Peter Berns is the CEO of Hyperstone, a producer of Flash Memory Controllers for Industrially Embedded Storage Solutions. Before that, he held a Senior Manager Position at Toshiba Electronics for several years. Jan Peter brings more than 20 years of management and executive experience in the semiconductor… Read More


Today’s SoC Design Verification and Validation Require Three Types of Hardware-Assisted Engines

Today’s SoC Design Verification and Validation Require Three Types of Hardware-Assisted Engines
by Daniel Nenni on 09-06-2022 at 6:00 am

IC Chip Low angle light emitting 600x600

Lauro Rizzatti offers Semiwiki readers a two-part series on why three kinds of hardware-assisted verification engines are now a must have for semiconductor designs continues today. His interview below with Juergen Jaeger, Prototyping Product Strategy Director in the Scalable Verification Solution division at Siemens EDA,… Read More


Verifying 10+ Billion-Gate Designs Requires Distinct, Scalable Hardware Emulation Architecture

Verifying 10+ Billion-Gate Designs Requires Distinct, Scalable Hardware Emulation Architecture
by Daniel Nenni on 08-29-2022 at 6:00 am

960 x 540 Veloce

In a two-part series, Lauro Rizzatti examines why three kinds of hardware-assisted verification engines are a must have for today’s semiconductor designs. To do so, he interviewed Siemens EDA’s Vijay Chobisa and Juergen Jaeger to learn more about the Veloce hardware-assisted verification systems.

What follows is part one,… Read More


2022 Semiconductor Supercycle and 2023 Crash Scenario

2022 Semiconductor Supercycle and 2023 Crash Scenario
by Daniel Nenni on 08-26-2022 at 6:00 am

2021 Semiconductor Forecast Summary

Charles Shi, semiconductor analyst at Needham & Company, an US-based investment bank and asset management firm, hosted an expert call on semiconductor cycles with Malcolm Penn, Founder and CEO of Future Horizons on 18 August 2022, with over 100 financial analysts in attendance.  The following bulletin is a summary of the… Read More


WEBINAR: A Revolution in Prototyping and Emulation

WEBINAR: A Revolution in Prototyping and Emulation
by Daniel Nenni on 08-23-2022 at 6:00 am

MimicPro Picture

This webinar will introduce to you a revolutionary new way to do prototyping and emulation at best-in-class performance, productivity, and pricing by unifying the hardware and a new software stack so one system is capable of prototyping and delivering essential emulation functionality.

Register Here

The speed of Moore’s law… Read More


An EDA AI Master Class by Synopsys CEO Aart de Geus

An EDA AI Master Class by Synopsys CEO Aart de Geus
by Daniel Nenni on 08-19-2022 at 8:00 am

Aart de Geus White House

I consider Dr. Aart de Geus one of the founding fathers of EDA and one of the most interesting people in the semiconductor industry. So it is not a surprise that Aart was chosen to attend the CHIPs Act signing at the White House.

Here is his current corporate bio:

Since co-founding Synopsys in 1986, Dr. Aart de Geus has expanded Synopsys… Read More