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Following Dan's argument, Intel would have to wait as long as it takes for High-NA to be ready. Therefore, their current rush is, once again, not necessarily good timing.
The argument for TSMC's 2016 good timing is not so convincing when considering Samsung's counterexample since the latter did...
In what is seen as a symbol of China’s “semiconductor rise,” SMIC ascended to third place in the global foundry (semiconductor manufacturing services) market in the first quarter of this year, trailing behind Taiwan’s TSMC and South Korea’s Samsung Electronics. This marks the first time a...
Customers would be sharing the use of the ASML-imec High-NA Lab for resist/underlayer testing:
https://www.spiedigitallibrary.org/conference-proceedings-of-spie/12953/129530P/The-next-step-in-Moores-law--high-NA-EUV/10.1117/12.3009070.full#_=_
I think a 4F^2 DRAM is more likely than a crossbar new memory type. It is the same form factor, but much easier to design for, as well as cheaper materials.
TheElec is sometimes enthusiastically pro-Korean, so in mentioning only Samsung and SKHynix, author didn't realize SKHynix was not foundry. 10nm (1d) will have unavoidable substantial multipatterning, so 3D-DRAM is actively being developed today. I have already heard quite a few proposals at IMW...
Is Intel 7 still running with SAQP? I read that Intel 4 also continued use of SAPQ for tightest pitch.
Interesting also that they didn't buy many more of the NXE systems instead, perhaps they couldn't and the first few EXE shipments was the result?
Not surprisingly, this kind of article got the technical statements all wrong. In fact, collected light is lost through the obscuration (hole in mirror). The NA is about focusing light in space but in an EUV resist, there are electrons spread, so the connection between NA and resolution is...
https://www.gizchina.com/2024/05/11/huawei-no-longer-needs-qualcomm-chips/
EFE UDIN MAY 11, 2024
Qualcomm, a leading American semiconductor company, has recently confirmed that Huawei, a Chinese telecommunications giant, no longer requires its processors. This announcement comes amidst ongoing...
It's a big rebuild for the High-NA system, so their current EXE would be a wasted evaluation. Maybe they are seeing the productivity pitfalls of mixing with conventional field systems. It's possible they are still anticipating some large GPU die not just processor chiplets.
https://www.j-ic.co.jp/en/news/.assets/E_20240417_JIC_JICC_PressRelease.pdf
Government-backed Japan Investment Corporation (JIC) completed takeover of Japanese photoresist manufacturer JSR, which previously acquired Inpria, the maker of metal oxide photoresists. There are ongoing lawsuits...
There were some hints the decision by Intel to pursue High-NA was made without thinking everything through. The clearest evidence is their sudden push for a larger (2X) mask size, supposedly driven by cost.
Right now a bigger problem than High-NA is the EUV resist, a little surprised that was not explicitly mentioned in the TSMC report:
(from ASML's HNA print)
It looks like A14 development is not hinging on High-NA either:
"TSMC started development and made good progress on 14 Angstrom (A14) technology, which aims to further improve speed, power, density and cost," the company's Annual Report reads. "Looking ahead to A14 and beyond, TSMC R&D will...
For TLDR needs:
The Memory Business returned to profit as it achieved qualitative growth by addressing the demand across servers, storage, PC and mobile, focusing on high-value-added products such as HBM, DDR5, server SSDs and UFS 4.0., along with the increase in ASP.
The Foundry Business...