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Atrenta to Participate in SemiWiki.com Cloud Based Social Media Platform

Atrenta to Participate in SemiWiki.com Cloud Based Social Media Platform
by Daniel Nenni on 01-13-2011 at 8:35 am

Atrenta Inc., the leading provider of Early Design Closure® solutions to radically improve design efficiency throughout the IC design flow, announced today that it will participate in a worldwide social media platform aimed at facilitating mass communication for electronic design professionals through Web 2.0 technologies.

The stated goal of SemiWiki.com is to “bring technology and technologists closer together than ever before, closing the gap between pre-sales expectations and post-sales experience.” Atrenta, along with other members of the EDA, IP and foundry ecosystem, will contribute content such as company and product wikis, blogs and discussion forums.

“Atrenta had been searching for a way to reach out to its users to promote interactive discussion on design experiences and best practices,” said Mike Gianfagna, vice president of marketing at Atrenta. “SemiWiki.com provided us with a well-planned platform to achieve our goal. I invite all of our users and prospective users to register and participate.”

“Our industry needs a site that facilitates real time, vendor neutral discussion from real users,” said Dan Nenni, EDA/semiconductor blogger, strategic consultant and founder of SemiWiki.com. “SemiWiki.com will provide our registered users with a connected community that promotes the open exchange of ideas, experiences and feedback.”

Daniel Nenni will be joined by industry bloggers Paul McLellan, Daniel Payne, and Eric Esteve on SemiWiki.com.

About Atrenta

Atrenta is the leading provider of Early Design Closure® solutions to radically improve design efficiency throughout the IC design flow. Customers benefit from Atrenta tools and methodologies to capture design intent, explore implementation alternatives, validate RTL and optimize designs early, before expensive and time-consuming detailed implementation. With over 150 customers, including the world’s top 10 semiconductor companies, Atrenta provides the most comprehensive solution in the industry for Early Design Closure. For more information, visit www.atrenta.com. Atrenta, Right from the Start!
Atrenta, the Atrenta logo and Early Design Closure are registered trademarks of Atrenta Inc. All others are the property of their respective holders.

About SemiWiki.com
The SemiWikiproject is a cloud based social media platform that will enable mass collaboration using Web 2.0 technologies (blogging, forums, and wikis) in order to enable new channels of communication within the semiconductor design ecosystem. REAL user based content, REAL TIME feedback, REAL social media has finally come to EDA, Semiconductor IP, and Foundries. SemiWiki Bloggers include Daniel Nenni, Paul McLellan, Daniel Payne, and Eric Esteve.


CES GlobalFoundries Party ( pics )

CES GlobalFoundries Party ( pics )
by Daniel Nenni on 01-11-2011 at 1:13 am

Unlike the last CES, this year I saw compelling technology, technology that will definitely drive the semiconductor industry and make the analyst fortunetellers look bad yet again. Anyone who thinks semiconductor growth next year will be in single digits is absolutely wrong, TSMC will grow even more, 20%+. First and foremost however, the GlobalFoundries CES party!

The venue was small but the food was good and it was well attended. It was in a “fantasy” suite at the Palms Casino Resort. There was a glass DJ booth with a pole in the middle but I didn’t see any Firemen.

My favorite EDA CEO was there (Walden Rhines) with his beautiful wife. His Wall Street name is Walden but I get to call him Wally. Wally spends more time on the road than I do but I spend more time in the customer trenches and with the foundries so we had plenty to talk about (a blog in itself). We also talked about the EDAC CEO Panel, business in general, and kids. His daughters are a few years ahead of mine so I was interested to see what my two teenage daughters have in store for me. Mrs. Rhines charmed me completely, wow! Mentor Graphics has 15 new hires, 1 promotion or change, 10 recent departures, and 19 new job opportunities Per my Monday morning tweet: #Globalfoundries Plans to Double CAPEX to $5.4B! Had drinks with CFO Robert Krakauer @ #CES

Bob Krakauer, GlobalFoundries CFO, is a very nice, easy speaking guy, with a serious semiconductor background. Bob was President of MagmaChip and worked for Altera, and ChipPac. The big buzz at the party was the GlobalFoundries $5.4B CAPEX number which is HUGE! Expect TSMC to beat that number but the takeaway here is that ATIC is serious about the foundry business and GlobalFoundries will have whatever capitol it will need to be successful, believe it. GLOBALFOUNDRIES has 18 new hires, 5 promotions or changes, 9 recent departures, and 10 new job opportunities .

I spoke with Simon Segars (ARM) and Mojy Chain, these guys were all smiles and with good reason. Hiring Mojy was one of GlobalFoundries’ smartest moves, partnering with ARM even smarter. As I bet in a previous blog, this CES conference belonged to ARM, even without the Windows announcement. ARM owns mobile devices, mobile devices will drive semiconductor for 2011 and beyond, ARM and GlobalFoundries are intimate partners, you do the math.$$$$$$$$$$$$$$$$$

Intel versus ARM (Linaro)

November 28, 2010 Daniel Nenni More than 2,500 companies will be exhibiting and more than 120,000 people will be attending the next Consumer Electronics Show (CES) and it is an easy bet that ARM processors will dominate the show yet again. In fact, my money is on ARM to dominate future generations of computing platforms (smartphones) due in large part to one simple word…… Linaro!

This is

Jason Gorss, Technology Communications Manager for GlobalFoundries. Jason is 7 feet tall so no way was I going to get a picture next to him.

These guys are more picture compatible, see how tall I look? Michael Buehler-Garcia from Mentor and Rich Goldman from Synopsys, both strong supporters of Social Media, leading edge guys, good senses of humor, and fun to drink with! After the GlobalFoundries party I went with my photographer to a mansion for a sushi party. Las Vegas Sushi parties are not what you may think. Unfortunately those pictures come under the “What happens in Las Vegas stays in Las Vegas” rule so I can’t post them.


EDA360 in PC Today

EDA360 in PC Today
by Paul McLellan on 01-10-2011 at 8:29 pm

At the EDAC CEO panel, Daniel pointed out that he used EDA360 as a good introduction to non-specialists (e.g. financial sector). I just discovered today that the cover article of PC Today is by John Bruggeman (well, Cadence) about EDA360. Having some idea of just how difficult it is to get that sort of specialist article into a general interest publication (we all want an article in the Wall Street Journal right?) I think it is quite an achievement. I doubt one article will have much direct impact on anyone’s business, but if the general idea of what EDA and its surrounding ecosystem is all about then it can’t help but be positive.

Join the EDA360 discussion HERE.


EDA / IP Business Model Debate

EDA / IP Business Model Debate
by Daniel Nenni on 01-09-2011 at 11:39 am

First, lets review the business model transitions EDA has seen. We started with perpetual licensing which is a software license for the life of the product. EDA companies did their best to change product names to get incremental revenue above and beyond the yearly 15% maintenance fee but that is a dead end business model for a confined software industry like EDA.

The concept of a 3-year time-based license business model came from Avant! (definitely not a status quo company). I salute the person who came up with it, it literally saved EDA. I doubt it was Gerry Hsu (Avanti CEO) but he most certainly took credit for it. I sold time-based licenses at Avanti and I can tell you it was one of the reasons Avant! did so well. Business models are everything.

The next EDA business model was the worst idea ever, flexible or all-you-can-eat software licensing. Cadence brought this scourge on the industry and I believe it was then Cadence CFO Ray Bingham who did it. I can only guess that this was a Cadence competitive shot at Aart de Geus because Synopsys was gaining market share fast. Of course it almost killed Cadence and they are still recovering from it years later. Jack Harding was Cadence CEO at the time and he took the fall for it. I credit Ray Bingham for dodging that bullet and actually getting promoted to CEO as a result of this industry crushing mistake.

Unfortunately Synopsys has taken the flexible license (Enterprise) model to a whole new level and has used it against Cadence and EDA in general ever since. At the EDAC CEO panel Aart clearly stated to me that he does not believe success based business models will work in EDA and belittled my suggestion that EDA reinvent itself using Apple and Google as examples.

Okay, here is the funny part, I love the irony here. Jack Harding left Cadence and started eSilicon. eSilicon applied a success based business model (the foundry business model actually) to semiconductor design services, a business that both Synopsys and Cadence failed at. Jack and I worked at Zycad years ago and I can tell you he is not a “status quo” type of guy like the current EDA CEO’s. And for those of you who think eSilicon is NOT successful think again, they are North of $100M in revenue and could be as high as $150M, believe it. The other success based business model in our industry is IP. Unfortunately, now that Synopsys is an “all-you-can-eat” IP company, that will also change so beware ARM and other success based IP companies!

So you have to ask yourself why is Synopsys limiting the financial growth of our industry? The answer of course is that Synopsys is so caught up in the competitive aspect of our business, crushing others, Synopsys cannot see past it (my opinion). Correct me if I’m wrong, you can join the discussion HERE.

EDAC CEO Panel Photo by Joe Hupcey III


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IP-SoC trip report (part I): how analyst sees the future of IP (and forecast the past)

IP-SoC trip report (part I): how analyst sees the future of IP (and forecast the past)
by Eric Esteve on 01-06-2011 at 10:44 am

I will share with you the most interesting I have heard during IP-SoC 2010, last December in Grenoble. Today, let’s summarize what I heard about the future of the IP business. The presentation was done by Gartner, in the “Auditorium” (largest room). It first started with the results for 2010, and I took some notes, as you can see the business figures are very informative:

Overall IP business growth (2010/2009) was +24.8%, for a total of $1677M

  • IP licensing (50% of total) grew by 20%, royalties (42%) grew by +31% and maintenance/services (8%) by 25%.

This “forecast” is useful, as well as some trends proposed by Gartner about the IP market:

  • Innovation is moving from chip level to system level was the clear message. Or, if you prefer, be prepared to provide not only a piece of H/W to be used within a chip, but a more complete solution integrating several pieces of H/W, the drivers for these, and the S/W at system level. (We will come back to this in a next post).
  • In Automotive and Industrial, the IP usage will be growing from being 5 to 10% of a chip to 30 to 40% within 3-5 years.
  • In Wireless, IP usage will double and pass from 20% today to 40% in 2013/14.

Good to hear, this means that the IP market, as a business, should be growing in value per license (moving from chip to system level) and in license number, as the IP usage is strongly growing in at least two segments. Then came the growth forecast for 2011 to 2014. Don’t worry, I will share it with you:+6% in 2011, then +2.3% in 2012, followed by +6.7% in 2013 and 6.9% in 2014.Here I disagree! How cans a certain market strongly grow in unit value and in unit count, and posts a mere 5.8 CAGR ? I know the number of ASIC/ASSP design starts is expected to go down, but only by 2 or 3% per year. And the FPGA design starts also generate license sales (another post will come, as I have attended to the FPGA panel, see: http://www.design-reuse.com/ipsoc2010/program/panel_fpga.htmlSo I decided to dig into these figures, here is that I found.Using the forecast for 2010-2015 I have built for the Interface IP market(see: http://www.ip-nest.com/index.php?page=wired)analyzing precisely USB, PCIe, HDMI, DDRn, SATA, MIPI and a few others protocols, I have built this table.For 2010/2015, the CAGR is: 14.3%Using Gartner’s figures above listed, I have built a similar table, including all the IP segments. .For 2010/2015, the CAGR is 5.8%Now, extracting the expected market growth for all the IP businesses: Processor, Memories, Libraries, Mixed Signal, Digital… everything at the exception of the Interface IP, becomes pretty simple (no problem, I give you the formula: when a = b + c, then b = a – c; rocket science!). So the new table: the CAGR is now 2.7% !!What do you think? Is it realistic to expect a growth rate between 2 and 3% for a certain market, when everybody says the IP usage will grow (double?) because that is the only way to guarantee the TTM, for ASIC, ASSP and also FPGA?I really would appreciate your comments about this!


Variation-aware Design Survey

Variation-aware Design Survey
by Paul McLellan on 01-05-2011 at 5:56 pm

Solidohas run an interesting survey on variation-aware design. The data is generic and not specific to Solido’s products although you won’t be surprised to know that they have tools in this area.

What is variation-aware design? Semiconductor manufacturing is a statistical process and there are two ways to handle this in the design world. One is to abstract away from the statistical detail into a pass/fail environment with concepts like minimum spacing rules and worst-case transistor timing. Meet the rules and the chip will yield. This is largely what we do in the digital world although with the complexity of modern design rules and the number of process corners that we now need to consider a lot of the complexity of the process is bleeding through anyway. But there is an underlying assumption in this approach that within-die variation is minimal. In fact the very idea of a process corner depends on this: all the n-transistors are at this corner and the p-transistors are at that corner.

But for analog this approach is no longer good enough, instead the design needs to be analyzed in the context of process variation for which the foundry needs to provide variation models. This requires statistical techniques in the tools to take the statistical data from the process and estimate its effect on yield, timing and power. It remains unclear to what extent these approaches will become necessary in the digital world as we move down the process nodes.

Solido had an agency survey several thousand IC designers of which nearly 500 completed the survey, so this is quite a large survey. They are a mixture of management and custom designers (so not digital designers).

The number #1 problem where they felt that advances were needed in tools were variation-aware design (66%) followed by parasitic extraction (48%). Coming up at the rear I don’t think anyone will be surprised that there isn’t a burning desire for major improvements in schematic capture (7%).
Of course the main reason people want variation-aware technology is to improve yield (74%) and avoid respins (64%) which is really just an extreme case of yield improvement! They also wanted to avoid project delays since over half of the groups had missed deadlines or had respins due to variation issues, typically causing a 2 month slip.

When asked which process node people though variation-aware design was important, surprisingly about 10% said that it was already important at 0.18µm, but that number is up to 60% by 65nm and 100% by 22nm.

So this is definitely something the analog guys need to worry about now, and digital need to be aware of. Indeed, Solido is part of the TSMC AMS reference flow (and other companies such as Springsoft and Synopsys have some variation-aware capabilities).


Magma’s new version of Talus and updating infrastructure

Magma’s new version of Talus and updating infrastructure
by Paul McLellan on 01-04-2011 at 5:51 pm

One of the important but often unrecognized aspects of engineering is re-building the infrastructure underneath key design tools. Sometimes this gives a new desirable capability but often a lot of the effort is simply to modernize the code base so that it is possible to continue development effectively going forward. For example, I remember in Compass days replacing our creaky graphics infrastructure with something more modern. It was expensive to do and it didn’t generate any additional revenue, but the old code had been written well over a decade before and was no longer adequate. Because this sort of infrastructure underlies everything, it is rather like changing the wheel of a car without stopping.

I met with Bob Smith of Magma late last year, and coincidentally I ran into Hamid Savoj, the CTO, at a conference on 3D chips a few days later. They have successfully done one of these changing the wheels without stopping exercises recently.

Magma’s engineering team have swapped out the old timing and extraction engines from Talus and replacing them with the Tekton timing engine and the QCP extraction engine to create Talus Vortex 1.2. This can place and route over one million cells per day with all the modern requirements for crosstalk, metal migration, multi-corner etc. It can handle up to 3M cells flat, which is important since probably one of the biggest wishes of the semiconductor customers is to be able to handle designs flat, or with as little hierarchy as they can get away with. Ideally today they would like to be able to handle 20 million cells or more flat. All hierarchy added in any design tool due to capacity limitations of the tool tends to cause design efficiency to drop, sometimes dramatically if the number of blocks grows large. But wait, there’s more, as the old ads say.

Along with some further infrastructure work they have also created Talus Vortex FX which is the first distributed place and route solution. This pushes up the performance to over 3 million cells per day, and the capacity up above 8 million cells, which more than triples designer productivity. It analyzes the design, then partitions it into pieces that can be processed separately on their own server, and then eventually combines all the results back together (they call this Smart Sync). Some design tools are fairly easy to distribute (for example, DRC can be run on different parts of the chip in parallel and then stitched back together), some are very difficult (simulation, because there is a single global time-base so it is hard to find things that are independent) and some in between like place and route, although clever algorithms are needed to decide how to divide up the design amongst the computing resources.

As an irrelevant aside, in 1952 a car was driven across the US and back without stopping; of course it needed to have facilities to change a wheel without stopping. It can be seen today in the San Diego Automotive Museum.


The Ultimate SPICE Circuit Simulator

The Ultimate SPICE Circuit Simulator
by Daniel Payne on 01-03-2011 at 1:19 pm


I love SPICE and Fast SPICE circuit simulators, so here’s my feature list for the ultimate SPICE circuit simulator:

[LIST=1]

  • Input netlists – HSPICE, Spectre, ELDO
  • Multi-core support – parse and simulate fast and accurate
  • LRC Reduction – built-in LRC reduction with a few knobs to control accuracy
  • Tuning – Intuitive options to trade off speed and accuracy
  • Output waveforms – compatible with industry standard formats
  • Interactivity – able to stop, browse and continue simulations with Tcl functions and command line functions
  • Analysis – DC, Transient, Monte-Carlo, Noise, Sensitivity
  • Monte-Carlo – smart method to launch and control jobs
  • Co-simulation – integrated with HDL simulators: VHDL, Verilog, System Verilog, System C
  • OS – Linux, Windows 7
  • Environment – Works in my Cadence, Synopsys, Mentor, Magma flows
  • Models – Industry standards like BSIM3, BSIM4. Foundry supported.
  • Speed – the faster the better
  • Accuracy – no surprises with Silicon results
  • Learning Curve – just take it out of the box and it works
  • Installation – I don’t want to read the install notes, it should install like shrink-wrap PC or Mac software
  • Licensing – FlexLM is OK
  • Error and warning messages – something that an engineer can understand, no 5 digit look-up codes
  • Tech support – 24 hour response time to my critical bugs
  • Updates – online, easy to get the latest version or a few versions back

    What would you like to see in the ultimate SPICE circuit simulator?

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  • The Future of Semiconductor Design!

    The Future of Semiconductor Design!
    by Daniel Nenni on 12-26-2010 at 10:15 pm

    Is EDA still an appropriate term for what we do? What applications will drive future semiconductor design innovation? Will further consolidation be required for EDA to thrive again? They are all good questions, questions that will hopefully be properly addressed at the EDAC CEO Forecast and Industry Vision event next week but here are my thoughts:

    Is EDA still an appropriate term for what we do? According to the most recent press releases:
    Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP for semiconductor design, verification and manufacturing, today announced……

    Cadence Design Systems, Inc. (NASDAQ: CDNS), a global leader in electronic design innovation….

    Mentor Graphics Corporation (NASDAQ: MENT) is a world leader in electronic hardware and software design solutions………
    Magma® Design Automation Inc. (Nasdaq:LAVA), a provider of chip design software…..

    Not that EDA companies ever called themselves EDA companies in print, but I do see a disconnect here. One of the things I do for a living is provide background information to semiconductor industry investors. The foundries and their top customers are of BIG INTEREST, EDA and IP not so much. I have even conference called with analysts who have JUST attended EDA CEO presentations and they still don’t see the value in EDA. If you want to know the number one problem with EDA, that is it, communication. We really suck at it.

    What applications will drive future semiconductor design? That should be obvious after Christmas, EMBEDDED SYSTEMS! We got a new minivan for Christmas and you would not believe the electronics packages that are available today. Seriously, it’s like piloting a space shuttle. There has to be dozens of microprocessors and sensors embedded into this vehicle. Video cameras, collision avoidance, satellite, GPS, split screen DVD, electric doors, and disappearing seats just to name a few. Seriously, you push a button and the back seat automatically folds into the floor. The manual for this vehicle is hundreds of pages, hopefully one of my kids will read it someday.

    Currently embedded systems account for $200B+ of the $300B+ semiconductor revenues. That is if we can agree that an “embedded system” is an electronic device with a special purpose processor, including smartphones. The other $100B+ has general purpose processors driving them. Future semiconductor growth will come from the embedded side for sure.

    Will further consolidation be required for EDA to thrive again?Yes of course, I think we can all agree on that. My biggest concern however is the lack of EDA and IP start-ups. You will be hard pressed to find investors for semiconductor design. The top EDA companies are not helping much either. Remember when EDA partner programs were open? How about when the top EDA companies had incubators and VC funds? If the top EDA companies spent half as much time nurturing emerging companies as they do trying to kill them we would all be better off.

    Here’s the irony on the investment side, VC’s are spending billions of dollars on Facebook, Twitter, Zynga, and other mindless applications, but when it comes to the tools and IP that build the platforms? Pffft. How about when Google, Apple, and/or Oracle start buying ARM, Synopsys, and the other key semiconductor enablers? That will shake things up a bit and maybe we will remember where we all came from, START-UPS!