When I worked at Intel designing custom chips my management would often ask me, “Will first silicon work?” My typical response was, “Yes, but only for the functions that we could afford to simulate before tape-out.” This snarky response would always cause a look of alarm, quickly followed by a second … Read More
I’ve owned and used many generations of cell phones, starting back in the 1980’s with the Motorola DynaTAC phone and the biggest usability factor has always been the battery life, just how many hours of standby time will this phone provide and how many minutes of actual talk time before the battery needs to be recharged… Read More
A couple months ago we heard from another vendor in a webinar on HBM and breaking through the “memory wall”. Next week Open Silicon weighs in on the topic in a webinar with partners SK Hynix and Synopsys.… Read More
Working at Intel as a circuit designer I clearly remember how there were three distinct groups: Process Development, CAD and Circuit Design. Each of the groups sat in a different part of the building in Aloha Oregon, we had different job titles, different degrees, spoke with different acronyms and yet we all had to work together … Read More
Imagine being able to use any combination of EDA vendor tools for schematic capture, SPICE circuit simulation, layout editing, place & route, DRC, LVS and extraction. On the foundry side, how about creating just a single Process Development Kit (PDK), instead of vendor-specific kits. Well, this is the basic premise of a recent… Read More
EDA vendors have long used proprietary file and database formats to keep their users locked into their specific tool flow and keep any competitors from sharing in the IC design process. Along the way the actual users of EDA tools have often requested and helped to create interoperable flows so that they could mix and match multiple… Read More
We blog a lot about Moore’s Law, and even “More than Moore” where 3D integration of ICs and systems are used to get lower product costs. One big challenge with 3D integration of ICs is that most EDA software was really intended only for abstracting at 2D or 2.5D structures. Over the past several years there have … Read More
Do you remember how auto maker Toyota had to pay a $1.2 billion settlement in 2014 because some of their automotive models experienced sudden, unintended acceleration? That scenario has to be an engineer’s worst nightmare because something was missed during the design and testing of an automotive electronics system that… Read More
ARM is a well-known semiconductor IP provider and they often create a reference design so that SoC companies can have a starting point to work with. On the GPU side of IP the ARM engineers have an architecture called Mali, and a recent webinar hosted by Synopsys reviewed how the physical design area was minimized by using a combination… Read More
My first exposure to automating IC layout was back in the 1980’s at Intel where I coded a layout compiler to auto-generate about 6% of a graphics processor chip. The need to use automation for IC layout continues today, and with the advent of FinFET technology there are some new challenges like layout gradient effects that … Read More
