The nearly unavoidable truth about dynamic voltage drop (DVD) signoff for power distribution networks (PDN) is that the quality of results depends on the quality and quantity of the vectors used to activate the circuit switching. As SOCs grow larger and are implemented on smaller nodes, the challenges of sufficient coverage … Read More
It’s been the case most of the time that until we hit a bottleneck situation, we do not realize that our focus is not at the right spot. Similar is the case with power analysis at the SoC level. Power has become equally if not more important than the functionality and other parameters of an SoC, and therefore has to be verified earlier … Read More
Last month in DAC I could see some of the top innovations in the EDA world. EDA is a key enabler for advances in semiconductor designs. Among a number of innovations worth mentioning (about which I blogged just after DAC), the integration of Mentor’s Veloce with ANSYS’ PowerArtist for power analysis of live applications caught my… Read More
SoC design these days has become a complex and tricky phenomenon involving integration of multiple IPs and legacy RTL code which could be in different languages, sourced from various third parties across the globe. Understanding and reusing RTL code is imperative in SoC integration which needs capable tools that can accommodate… Read More
I think by now there has been good level of discussion on FinFET technology at sub-20 nm process nodes and this is an answer to ultra dense, high performance, low power, and billion+ gate SoC designs within the same area. However, it comes with some of the key challenges with respect to power, noise and reliability of the design. A FinFET… Read More
It feels to be at the top of semiconductor technology by having dies with high density of semiconductor design at sub-20nm technology node stacked together into a 3D-IC to form a complete SoC which can accommodate billions of gates. However there are multiple factors to be looked at in order to make that successful amid often conflicting… Read More
A semiconductor SoC design can have multiple components at different levels of abstractions from different sources and in different languages. While designing an SoC, IPs at different levels have to be integrated without losing the overall design goals. Of course, quality of an IP inside and outside of an SoC must be tested thoroughly.… Read More
As power has become one of the most important criteria in semiconductor design today, I was wondering whether there is a standard set for the power verification for an overall chip. We do have formats evolved like CPF and UPF and there are tools available to check power and signal integrity (SI), however I don’t see a standard objective… Read More
