Transistor fabrication has spanned the gamut from planar devices o FinFET to Gate-All-Around (GAA) as silicon dimensions have decreased in the quest for higher density, faster speeds and lower power. Process development engineers use powerful simulation tools to predict and even optimize transistor performance for GAA devices.… Read More
In Silvaco’s June 2025 Tech Talk, “The Diffusion of Innovation: Investing in the Ecosystem Expansion,” Chief Revenue Officer Ian Chen outlined how strategic partnerships accelerate R&D in semiconductor design and digital twin modeling. As a leading provider of TCAD, EDA software, and SIP solutions,… Read More
Please join us at the Design Automation Conference 2025 where we will highlight the company’s wide range of EDA products and semiconductor IP targeting, Power Devices, Automotive, Memory, Displays, HPC, 5G / 6G, and IoT applications.
When: June 23 – 25, 2025, Exhibit Hours: 10:00 AM PDT – 6:00 PM PDT
Where: Moscone Center West,… Read More
Semiconductor fabs aim to have high yields and provide processes that attract design firms and win new design starts, but how does a fab deliver their process nodes in a timely manner without having to run lots of expensive silicon through the line? This is where simulation and TCAD tools come into play, and to learn more about this… Read More
Now that the dust has settled, I will give you my take on the Intel Foundry event. Some might call me a semiconductor event critic as I have attended hundreds of them over the last 40 years starting with the Design Automation Conference in 1984. Foundry events are my favorite because they really are the pulse of the semiconductor industry,… Read More
The International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) provides an international forum for the presentation of leading-edge research and development results in the area of process and device simulation. SISPAD is one of the longest-running conferences devoted to technology computer-aided… Read More
Readers of SemiWiki will be well aware of the challenges the industry has faced in photolithography in moving to new nodes, which drove the development of new EUV light sources as well as new masking techniques. Plasma etching is another key step in chip manufacturing that has also seen new challenges in the development of new sub-10nm… Read More
I was invited to give a plenary address at the SISPAD conference in September 2021. For anyone not familiar with SISPAD it is a premiere TCAD conference. This year for the first time SISPAD wanted to address cost and my talk was “Cost Simulations to Enable PPAC Aware Technology Development”.
For many years the standard in technology… Read More
In order to beat Moore’s Law NAND Flash memories have moved from a planar topology to 3D construction. This allows for increased memory sized in much the same way a multistory building provides more building square footage on the same size building lot. Just like in building construction, adding a third dimension to the mix increases… Read More
Flash memory has become ubiquitous, so much so that it is easy to forget what life before it was like. Large scale non-volatile storage was limited spinning disks, which were bulky, power hungry and unreliable. With NAND Flash, we have become used to carrying many gigabytes around with us all the time in the form of cell phones, USB… Read More
