User2User Europe 2025by Admin on 12-17-2024 at 11:48 am
Join us in Munich where peer-delivered technical sessions will be shared across a breadth of topics so you can explore new concepts or dive deep in your core area of expertise with fellow like-minded professionals.
Munich, Germany | May 13, 2025
Registration opens Feb. 10, 2025.
About User2User
The User2User conference is your… Read More
Dan is joined by Sathishkumar Balasubramanian. Sathish currently leads the product management and marketing organization for CustomIC Verification (CICV) division at Siemens. Sathish is an experienced product leader with over 20+ years of experience in the EDA industry.
Sathish’s focus is on bringing value to the semiconductor… Read More
The 15th TSMC Open Innovation Platform® (OIP) was held last week. In preparation we did a podcast with one of the original members of the TSMC OIP team Dan Kochpatcharin. Dan and I talked about the early days before OIP when we did reference flows together. Around 20 years ago I did a career pivot and focused on Strategic Foundry Relationships.… Read More
Dan is joined by William Ruby, director of product management for Synopsys Power Analysis products. He has extensive experience in the area of low-power IC design and design methodology, and has held senior engineering and product marketing positions with Cadence, ANSYS, Intel, and Siemens. He also has a patent in high-speed… Read More
In my job, I have the privilege to talk to hundreds of interesting companies in many areas of semiconductor development. One of the most fun things for me is interviewing customers—hands-on users—of specific electronic design (EDA) tools and chip technologies. Cristian Amitroaie, CEO of AMIQ EDA, has been very helpful in introducing… Read More
Cadence hosted a panel at DAC on how EDA, MCAD and industrial software have come together, a topic I always find interesting. Many years ago, I worked on a NAVAIR contract bid team, an eye-opener for a young engineer who thought that innovation started and ended with electronic design. I remember CATIA (3D modeling) being a component… Read More
As more AI applications turn to edge computing to reduce latencies, the need for more computational performance at the edge continues to increase. However, commodity compute engines don’t have enough compute power or are too power-hungry to meet the needs of edge systems. Thus, when designing AI accelerators for the edge, Joe… Read More
Product LifeCycle Management (PLM) systems have shown incredible value for integrating the enterprise with a single view of the product design, deployment, maintenance, and end-of-life processes. PLM systems have traditionally grown from the mechanical design space, and this still forms their strength.
Meanwhile, due… Read More
Much of the technology that goes into aerospace applications is some of the most advanced technology that exists. However, these same systems must also offer the highest level of reliability in what is arguably an extremely difficult environment. For semiconductors a major environmental risk in aerospace applications are … Read More
Typically, there is an existential rift between the on-chip access requirements for test and the need for security in SoCs. Using traditional deterministic scan techniques has meant opening up full read and write access to the flops in a design through the scan chains. Having this kind of access easily defeats the best designed… Read More
