RISC-V has emerged as a cornerstone of modern computing, offering an open-source alternative to proprietary designs like ARM and x86. Free from licensing fees and highly extensible, RISC-V powers everything from IoT devices to AI accelerators, with over 13 billion cores shipped globally. Annual RISC-V Summits, organized… Read More
The increasing demand for accelerated computing solutions calls for an agile hardware design methodology to be able to keep up with fast evolving landscape of algorithms. Traditional hardware design methodology has long development cycles involving defining architecture, doing microarchitecture development using RTL,
As digital chip design complexity grows, engineering teams face increasing pressure to meet aggressive PPA targets on tight schedules. To overcome this challenge, the EDA industry requires a revolutionary shift towards AI. Siemens EDA is leading this transformation by implementing a comprehensive strategy that combines… Read More
Can cash and IBM collaboration put Japan into premier-league chipmaking? Rapidus is betting billions it can.
When Japan announced the creation of Rapidus in 2022, the news was met with a mix of enthusiasm and skepticism. The company would enter the market at a time of escalating demand for semiconductor fabrication capacity to… Read More
Wednesday was the last day at #62DAC for me and I attended an Exhibitor Session entitled, Engineering the Semiconductor Digital Thread, which featured Vishal Moondhra, VP Solutions Engineering of Perforce IPLM and Michael Munsey, VP Semiconductor Industry at Siemens Digital Industries. Instead of just talking from slides,… Read More
The Component-based TPA and Virtual Prototyping Master Class is a 3-day live training event that brings together the NVH community at the NVH facility in Leuven, Belgium. This immersive program features theoretical lectures and insights from industry leaders, supported by live demonstrations, interactive sessions, and
Discover how proteanTecs is transforming health and performance monitoring across the semiconductor lifecycle to meet the growing demands of AI and Next-Gen SoCs.
Stop by DAC booth #1616 to experience our latest technologies in action, including interactive live demos and explore our full suite of solutions — designed to boost… Read More
Dan is joined by Sathishkumar Balasubramanian. Sathish currently leads the product management and marketing organization for CustomIC Verification (CICV) division at Siemens. Sathish is an experienced product leader with over 20+ years of experience in the EDA industry.
Sathish’s focus is on bringing value to the semiconductor… Read More
The 15th TSMC Open Innovation Platform® (OIP) was held last week. In preparation we did a podcast with one of the original members of the TSMC OIP team Dan Kochpatcharin. Dan and I talked about the early days before OIP when we did reference flows together. Around 20 years ago I did a career pivot and focused on Strategic Foundry Relationships.… Read More
Dan is joined by William Ruby, director of product management for Synopsys Power Analysis products. He has extensive experience in the area of low-power IC design and design methodology, and has held senior engineering and product marketing positions with Cadence, ANSYS, Intel, and Siemens. He also has a patent in high-speed… Read More
