Webinar: How AI is Accelerating Thermal Engineering for Space Missions

Webinar: How AI is Accelerating Thermal Engineering for Space Missions
by Admin on 08-03-2026 at 9:57 pm

It’s no secret that AI can transform engineering workflows.

But are you getting the most out of your AI efforts?

If you are struggling to leverage AI beyond scripting, this webinar is for you.

Join us to learn how you can use AI, with confidence, to accelerate thermal engineering for space missions.

Although design cycles are getting… Read More


How early symmetry validation eliminates costly late-stage respins

How early symmetry validation eliminates costly late-stage respins
by Admin on 07-27-2026 at 2:00 pm

article fig1 shift left

By Mauli Shah, Product Engineer, Siemens

Analog and mixed-signal design teams face a persistent challenge that directly impacts tape-out schedules and project predictability: symmetry violations discovered at signoff trigger expensive respins, delay schedules and create unpredictable iteration cycles. Despite symmetry… Read More


Webinar: Compensating for PCB laminate anisotropy in SI calculations

Webinar: Compensating for PCB laminate anisotropy in SI calculations
by Admin on 07-16-2026 at 6:19 pm

Why Your Impedance Models May Be Less Accurate Than You Think

For many years, the PCB industry has accepted dielectric values without fully understanding how they were measured—or whether they’re the right values for impedance modeling. This webinar explores what that means for today’s high-speed designs.

As … Read More


GPU-native mask rule checking eliminates the curvilinear mask rule check bottleneck

GPU-native mask rule checking eliminates the curvilinear mask rule check bottleneck
by Admin on 06-16-2026 at 10:00 am

fig1 gpu opc challenge

As semiconductor manufacturing pushes toward advanced nodes with tighter feature sizes, the optical proximity correction (OPC) workflow is adopting curvilinear masks to achieve the larger process windows that traditional Manhattan geometries cannot deliver.

Traditional Manhattan masks constrain shapes to vertical … Read More


Siemens to Deliver Industry-Leading PCB Test Engineering Solutions

Siemens to Deliver Industry-Leading PCB Test Engineering Solutions
by Daniel Nenni on 02-24-2026 at 8:00 am

Siemens Acquires ASTER Technologies to Deliver Industry Leading PCB Test Engineering Solutions

Siemens has strengthened its position in EDA and manufacturing by acquiring ASTER Technologies, a specialist in test and reliability solutions for printed circuit boards. The acquisition represents a strategic step in Siemens’ broader vision to deliver a fully integrated, end-to-end digital thread for electronics design,… Read More


Siemens and NVIDIA Expand Partnership to Build the Industrial AI Operating System

Siemens and NVIDIA Expand Partnership to Build the Industrial AI Operating System
by Daniel Nenni on 01-12-2026 at 6:00 am

CES 2026 Jensen Huang founder and CEO of NVIDIA Roland Busch President and CEO of Siemens AG

At CES in Las Vegas, Siemens and NVIDIA announced a major expansion of their long-standing collaboration, aiming to create what they term the “Industrial AI Operating System.” This ambitious initiative seeks to embed artificial intelligence deeply across the entire industrial value chain—from design and engineering… Read More


3D ESD verification: Tackling new challenges in advanced IC design

3D ESD verification: Tackling new challenges in advanced IC design
by Admin on 12-17-2025 at 10:00 am

fig1 3d structures

By Dina Medhat

Three key takeaways

  • 3D ICs require fundamentally new ESD verification strategies. Traditional 2D approaches cannot address the complexity and unique connections in stacked-die architectures.
  • Classifying external and internal IOs is essential for robust and cost-efficient ESD protection. Proper differentiation
… Read More