By Dina Medhat
Three key takeaways
Timing closure is one of the most challenging aspects of ASIC design. While traditionally seen as a backend process, its resolution begins at the architectural level and extends through the implementation stages. This webinar examines the key obstacles designers encounter and demonstrates how our timing closure solutions
By Niranjan Sitapure
Artificial intelligence (AI) is reshaping industries worldwide. Consumer-grade AI solutions are getting significant attention in the media for their creativity, speed, and accessibility—from ChatGPT and Meta’s AI app to Gemini for image creation, Sora for video, Sona for music, and Perplexity for web… Read More
By Mark Tawfik
Overview: Protecting ICs from costly ESD and latch-up failures
Electrostatic discharge (ESD) events cost the semiconductor industry an estimated $8 billion annually in lost productivity, warranty claims and product failures [1].
Ensuring the robust protection of integrated circuits (ICs) against various… Read More
RISC-V has emerged as a cornerstone of modern computing, offering an open-source alternative to proprietary designs like ARM and x86. Free from licensing fees and highly extensible, RISC-V powers everything from IoT devices to AI accelerators, with over 13 billion cores shipped globally. Annual RISC-V Summits, organized… Read More
Can cash and IBM collaboration put Japan into premier-league chipmaking? Rapidus is betting billions it can.
When Japan announced the creation of Rapidus in 2022, the news was met with a mix of enthusiasm and skepticism. The company would enter the market at a time of escalating demand for semiconductor fabrication capacity to… Read More
Wednesday was the last day at #62DAC for me and I attended an Exhibitor Session entitled, Engineering the Semiconductor Digital Thread, which featured Vishal Moondhra, VP Solutions Engineering of Perforce IPLM and Michael Munsey, VP Semiconductor Industry at Siemens Digital Industries. Instead of just talking from slides,… Read More
Discover how proteanTecs is transforming health and performance monitoring across the semiconductor lifecycle to meet the growing demands of AI and Next-Gen SoCs.
Stop by DAC booth #1616 to experience our latest technologies in action, including interactive live demos and explore our full suite of solutions — designed to boost… Read More
Dan is joined by Sathishkumar Balasubramanian. Sathish currently leads the product management and marketing organization for CustomIC Verification (CICV) division at Siemens. Sathish is an experienced product leader with over 20+ years of experience in the EDA industry.
Sathish’s focus is on bringing value to the semiconductor… Read More
The 15th TSMC Open Innovation Platform® (OIP) was held last week. In preparation we did a podcast with one of the original members of the TSMC OIP team Dan Kochpatcharin. Dan and I talked about the early days before OIP when we did reference flows together. Around 20 years ago I did a career pivot and focused on Strategic Foundry Relationships.… Read More
