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Join us for a full day of digital transformation stories shared by our customers and industry experts, exploring how design, PLM, simulation, and AI are driving innovation across the entire product lifecycle.
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Are you ready to get the most out of your CAD and product development software? Join us to find out how. Designcenter Solid Edge provides concrete solutions to the challenges you might encounter with other CAD systems. In this webinar, you’ll discover how to: – Reduce repetitive design tasks – Simplify the management
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Discover how to automate CFD simulations using Simcenter STAR-CCM+ to reduce manual effort and streamline workflows. Explore practical applications, from automated simulation setup to execution and report generation. Join us to learn how workflow automation can accelerate engineering analysis and improve productivity.… Read More
Space programs need reliable thermal predictions and the ability to evaluate more electronics designs in less time.
This means that you need a smarter modelling strategy.
Why?
– Modeling layers explicitly does not mean better results
– Different analysis objectives require different modeling approaches
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SoC teams are routinely told to “shift left”—to find design and verification problems earlier, where they are cheaper to fix—yet in most flows the first model that is both performance-accurate and authoritative is still the RTL, which arrives late and simulates slowly. This webinar will show that SystemC models built with the
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Siemens has announced advances in its collaboration with NVIDIA to accelerate computational lithography, addressing a demanding step in manufacturing advanced AI semiconductors. By integrating NVIDIA’s cuLitho library with Siemens Calibre manufacturing software, the companies aim to make sophisticated photomask optimization… Read More
Designing high-performance multi-chiplet semiconductor packages for hyperscale, HPC and AI applications combines cutting-edge innovation with practical optimization. Embedded silicon bridge substrates enable cost-effective solutions by using base substrates such as organic laminates or redistribution-layer (RDL)… Read More
Siemens and TSMC are expanding their collaboration on semiconductor design tools, with a focus on AI assisted workflows, advanced chip packaging and support for newer manufacturing processes. Their announcement centers on an AI agent intended to find and fix design rule violations: errors that can prevent a chip layout from… Read More
Engineering teams are dealing with increasing system complexity, stricter integration requirements and the shift toward software-defined products. Generative AI is emerging as a valuable capability, but it is not sufficient on its own.
To manage complexity and convergence across software and hardware, organizations need… Read More
Designing AI inference hardware for edge applications often requires building custom hardware accelerated solutions to meet the demands for ultra-low power consumption and strict real-time response requirements. This webinar introduces Catapult™ AI NN, which provides an automated flow that starts with a Python neural… Read More
