Designing a FinFET Test Chip for Radiation Threats

Designing a FinFET Test Chip for Radiation Threats
by Tom Simon on 04-04-2022 at 10:00 am

Charged Particles

Much of the technology that goes into aerospace applications is some of the most advanced technology that exists. However, these same systems must also offer the highest level of reliability in what is arguably an extremely difficult environment. For semiconductors a major environmental risk in aerospace applications are … Read More


Balancing Test Requirements with SOC Security

Balancing Test Requirements with SOC Security
by Tom Simon on 03-17-2022 at 6:00 am

Secure Test for SOCs

Typically, there is an existential rift between the on-chip access requirements for test and the need for security in SoCs. Using traditional deterministic scan techniques has meant opening up full read and write access to the flops in a design through the scan chains. Having this kind of access easily defeats the best designed… Read More


SIP Modules Solve Numerous Scaling Problems – But Introduce New Issues

SIP Modules Solve Numerous Scaling Problems – But Introduce New Issues
by Tom Simon on 01-27-2022 at 10:00 am

SIP Verification

Multi-chip modules are now more important than ever, even though the basic concept has been around for decades. With The effects of Moore’s Law and other factors such as yield, power, and process choices, reasons for dividing what once would have been a single SOC into multiple die and integrating them in a single module have become… Read More


DARPA Toolbox Initiative Boosts Design Productivity

DARPA Toolbox Initiative Boosts Design Productivity
by Tom Simon on 10-07-2021 at 10:00 am

DARPA Toolbox Initiative

When you think of the Defense Advanced Research Projects Agency (DARPA), this first thing that comes to mind is the development of the internet. And indeed, if you look at their website’s historic timeline, the development of ARPANET, as it was known at the time, is shown prominently in 1969. Incidentally, I actually used one of … Read More


Heterogeneous Package Design Challenges for ADAS

Heterogeneous Package Design Challenges for ADAS
by Tom Simon on 10-04-2021 at 10:00 am

Hetergeneous Package Design

Increasingly complex heterogeneous packaging solutions have proved essential to meeting the rapidly scaling requirements for automotive electronics. Perhaps there is no better example of this than advanced driver-assistance systems (ADAS) that are found in most new cars. In a recent paper published by Siemens EDA, they … Read More


Symmetry Requirements Becoming More Important and Challenging

Symmetry Requirements Becoming More Important and Challenging
by Tom Simon on 08-24-2021 at 10:00 am

Symmetry across the design flow

Humans certainly have always had an aesthetic preference for symmetry. We also see symmetry showing up frequently in nature. The importance of symmetry in electronic designs has been apparent for decades. There are a host of analog structures that require balanced layout. For instance, these include differential pairs and … Read More


Siemens Offers Insights into Gate Level CDC Analysis

Siemens Offers Insights into Gate Level CDC Analysis
by Tom Simon on 06-28-2021 at 10:00 am

CDC Analysis

Glitches on clock domain crossing signals have always been a concern for chip designers. Now with increased requirements for reliability, renewed scrutiny is being given to find ways to identify these problems and fix them. In particular applications such as automotive electronics have given this added effort an impetus. Siemens… Read More


Developing Verification Flows for Silicon Photonics

Developing Verification Flows for Silicon Photonics
by Tom Simon on 05-13-2021 at 10:00 am

Silicon Photonics DRC

Silicon photonics is getting a lot of interest because it can be used in many applications to improve bandwidth, reduce power and provide novel new functionality. It is especially interesting because it offers an ability to combine electronics and optical elements into the same die. Though it is fabricated with familiar silicon… Read More


Embedded Analytics Becoming Essential

Embedded Analytics Becoming Essential
by Tom Simon on 04-22-2021 at 6:00 am

Embedded Analytics

SoC integration offers huge benefits through reduced chip count in finished systems, higher performance, improved reliability, etc. A single die can contain billions of transistors, with multiple processors and countless subsystems all working together. The result of this has been rapid growth of semiconductor content … Read More


Library Characterization: A Siemens Cloud Solution using AWS

Library Characterization: A Siemens Cloud Solution using AWS
by Kalar Rajendiran on 03-29-2021 at 10:00 am

Characterization Runtime Chart

Pressing demands on compute speeds, storage capacity and rapid access to data are not new to the semiconductor industry. A desire for access to on-demand computing resources have always been there. During pre-cloud-computing era, companies provisioned on-demand compute capacity by procuring high performance computing … Read More