Intel announced its quarterly results a couple of days ago. They had previously downgraded 3rd quarter sales estimates but they managed to beat the downgraded numbers. If you look at the transcript of the call (I didn’t listen live) you’ll see very little mention of mobile and Atom. This is bad news for Intel. Its core… Read More
Tag: semiconductor
A Brief History of Mobile: Generations 3 and 4
The early first generation analog standards all used a technique known as Frequency Division Multiple Access (FDMA). All this means is that each call was assigned its own frequency band in the radio spectrum. Since each band was only allocated to one phone, there was no interference between different calls. When a call finished… Read More
Virtuoso Has Twins
Cadence has apparently announced that going forward the Virtuoso environment is going to be split into two and offered as two separate code-streams, the current IC6.x and a new IC12.x. The idea is to introduce a new product with features that were specifically developed for new technologies such as double patterning aware layout… Read More
Xilinx Programmable Packet Processor
At the Linley conference last week I ran into Gordon Brebner of Xilinx. He and I go a long way back. We had adjacent offices in Edinburgh University Computer Science Department back when we were doing our PhDs and conspiring to network the department’s Vax into the university network over a two-week vacation. We managed to … Read More
Current Timing Closure Techniques Can’t Scale – Requires New Solution
There’s a nice article on timing closure by Dr. Jason Xing, Vice President of Engineering at ICScape Inc. on the Chip Design website. Not familiar with ICScape? Paul McLellan called ICScape the The Biggest EDA Company You’ve Never Heard Ofand Daniel Payne did Schematic, IC Layout, Clock and Timing Closure from ICScape at… Read More
Laker3 in TSMC 20nm Reference Flow
SpringSoft, soon to be part of Synopsys but officially still a separate company for now, just announced that Laker[SUP]3[/SUP], the third generation of their layout product family, is featured in TSMC’s 20nm Custom Reference Flow.
Laker 20nm advancements include new double patterning-aware design and voltage-dependent… Read More
Multi-Voltage IC Design Flow
My new iPad lasts about 10 hours on a single charge and the A5X processor is designed with a 45nm process from Samsung. Processor chips for tablets like this use a multi-voltage IC design flow to reduce total power by:… Read More
A brief History of Mobile: Generations 1 and 2
Mobile is one of the biggest markets for semiconductor, especially if you count not just mobile handsets but also the base-station infrastructure. No technology has ever been adopted so fast and so completely. There are approximately the same number of mobile phone accounts as there are people in the world. A few people have more… Read More
Power Integrity Challenges for High Speed and High Frequency Designs
There is an interesting discussion on the LinkedIn SoC Power Integrity Group in regards to the power integrity challenges for high speed and high frequency designs. More specifically, the additional attention an on-chip power delivery network (PDN) requires as the operating frequency of ICs and SoCs increases.
The PDN has to… Read More
Advanced Node Design Webinar Series
At advanced process nodes, variation and its effects on the design become a huge challenge. Join Cadence® Virtuoso® experts for a series of technical webinars on variation-aware design. Learn how to use advanced technologies and tools to analyze and understand the affects of variation. We’ll introduce you to the latest Virtuoso… Read More