At ICCAD earlier this week, CEDA sponsored a talk by Alberto Sangiovanni-Vincentelli looking back over the last 30 years (it is the 30th anniversary of ICCAD) and looking to the future. As is always the case in these sorts of presentations, the retrospective contained a lot more detail than the going forward part. Clayton Christensen… Read More
Test is the Rodney Dangerfield of EDA, it doesn’t get any respect. All designs need to be tested but somehow synthesis, routing, analog layout and the rest are the sexy areas. In my spoof all purpose EDA keynote address I even dissed it:You are short on time so slip in a quick mention of manufacturing test. Who knows anything … Read More
Solido Design Automation and TSMC recently published an article in EE Times describing how Solido’s High-Sigma Monte Carlo tool is used with TSMC PDK’s to achieve high-yield, high-performance memory design. This project has been a big part of my life for the past three years and it is time for a victory lap!
In TSMC 28nm, 20nm and … Read More
It was not really a surprise to learn that, finally, MIPS have been sold, as the company was officially for sale since April 2012. Nevertheless, the interesting part of this news comes from the buyer’ identity: Imagination Technologies. Imagination is an UK based company, like ARM, selling processor IP cores, like ARM, but the … Read More
The common theme amongst semiconductor ecosystem conferences this year is FinFETS, probably the most exciting technology we will see this decade. A lot has been written on SemiWiki about FinFETS, it is one of the top trending search terms, but there is some confusion about the process naming so let me attempt to explain.
In planar… Read More
Our EDA industry loves three letter acronyms so credit the same industry for creating a five letter acronym CoWoS. Two weeks ago TSMC announced tape-out of their first CoWoS test chip integrating with JEDEC Wide I/O mobile DRAM interface, making me interested enough to read more about it. At the recent TSMC Open Innovation Platform… Read More
Electromigration (EM) is a reliability concern for IC designers because a failure in the field could spell disaster as in lost human life or even bankruptcy for a consumer electronics company. In the old days of IC design we would follow a sequential and iterative design process of:… Read More
Just in time for the Jasper User Group meeting, Jasper have a new white paper explaining the concept of JasperGold Apps.
First the User Group Meeting. It is in Cupertino at the Cypress Hotel November 12-13th. For more details and to register, go here. The meeting is free for qualified attendees (aka users). One thing I noticed at the… Read More
On Halloween, Atrenta and TSMC announced the availability of SpyGlass IP Kit 2.0. IP Kit is a fundamental element of TSMC’s soft IP9000 Quality Assessment program that assesses the robustness and completeness of soft (synthesizable) IP.
IP Kit 2.0 will be fully supported on TSMC-Online and available to all TSMC’s soft IP alliance… Read More
I went to Warren East’s keynote speech at ARM Techcon today. There had been some hints earlier in the week that some significant announcements would be made and, while they were not earth-shattering, I think that they will be significant in the long term.
One interesting thing that Warren pointed out is that the ARM partner… Read More
