Apache/Ansys presents: 3DIC thermal, transmission lines, low frequency analysis

Apache/Ansys presents: 3DIC thermal, transmission lines, low frequency analysis
by Paul McLellan on 12-16-2012 at 10:00 pm

Late in January it is DesignCon at the Santa Clara convention center from January 28th-31st. Details are here.

On Tuesday from 11.05 to 11.45 Apache and Ansys will be presenting on Thermal Co-analysis of 3D IC/packages/system. This is being presented by a whole team of people: Stephen Pan, senior product specialist at ANSYS; Norman… Read More


Apache Presents: ESD analysis

Apache Presents: ESD analysis
by Paul McLellan on 12-13-2012 at 1:15 am

The 26th Conference on VLSI Design will be in Pune, India from January 5th to 10th at the Hyatt Regency. Details on the conference here. Registration here. I happened to be involved in the first of these conferences, which was held in Edinburgh where I was wrapping up my PhD. It was in the considerably less palatial surroundings of … Read More


A Brief History of Synopsys

A Brief History of Synopsys
by Daniel Nenni on 12-12-2012 at 1:00 pm

One of the largest software companies in the world, Synopsys is a market and technology leader in the development and sale of electronic design automation (EDA) tools and semiconductor intellectual property (IP). Synopsys is also a strong supporter of local education through the Synopsys Outreach Foundation. Each year in multiple… Read More


Happy Holidays

Happy Holidays
by Paul McLellan on 12-10-2012 at 3:00 pm

At times of this year, companies usually get their salespeople to submit the names and addresses of all their customers. They then get an expensive card printed and mail it out. What the recipient does is anyone’s guess, from throwing it straight in the bin to using it to decorate the office.

Atrenta decided to do something … Read More


3D Architectures for Semiconductor Integration and Packaging

3D Architectures for Semiconductor Integration and Packaging
by Paul McLellan on 12-10-2012 at 4:00 am

There is obviously a lot going on in 3D IC these days. And I don’t mean at the micro level of FinFETs which is also a way of going vertical. I mean through-silicon-via (TSV) based approaches for either stacking die or putting them on an interposer. Increasingly the question is no longer if this technology will be viable (there… Read More


Double Patterning Verification

Double Patterning Verification
by Paul McLellan on 12-10-2012 at 3:03 am

You can’t have failed to notice that 20nm is coming. There are a huge number of things that are different about 20nm from 28nm, but far and away the biggest is the need for double patterning. You probably know what this is by now, but just in case, here is a quick summary.

Lithography is done using 193nm light. Today we use immersion… Read More


Apache Power Artist Capabilities I

Apache Power Artist Capabilities I
by Paul McLellan on 12-06-2012 at 2:05 pm

I sat down last week with Paul Traynar who was over from UK. He is Apache’s PowerArtist guru. The first thing we talked about was PowerArtist’s sequential power reduction capabilities.

Forward propagation of enables means that when a register is clock gated and feeds a downstream register then that register can be… Read More


A Brief History of the Fabless Semiconductor Ecosystem

A Brief History of the Fabless Semiconductor Ecosystem
by Daniel Nenni on 12-05-2012 at 7:00 pm

Clearly the fabless semiconductor ecosystem is driving the semiconductor industry and is responsible for both the majority of the innovation and the sharp decline in consumer electronics costs we have experienced. By definition, a fabless semiconductor company does not have to spend the time and money on manufacturing related… Read More


Formal Analysis of Security Data Paths

Formal Analysis of Security Data Paths
by Paul McLellan on 12-05-2012 at 5:07 pm

One challenge with security in systems is to ensure that there are not backdoors, either accidentally or maliciously inserted. Intel, ARM and others have various forms of trusted execution technology. Under the hood these are implemented by dividing the design into two parts, normal and secure, and implementing them with physical… Read More


Double Patterning Exposed!

Double Patterning Exposed!
by SStalnaker on 12-04-2012 at 7:15 pm

Wanna become the double patterning guru at your company? David Abercrombie, DFM Program Manager for Calibre, has written a series of articles detailing the multifaceted impacts of double patterning on advanced node design and verification. For designers struggling to understand the complexity and nuances of double patterning,Read More