Epitaxy: Not Just For PMOS Anymore

Epitaxy: Not Just For PMOS Anymore
by Paul McLellan on 07-25-2013 at 2:25 pm

At Semicon I met with Applied Materials to learn about epitaxy. This is when a monocrystalline film is grown on the substrate which takes on a lattice structure that matches the substrate. It forms a high purity starting point for building a transistor and is also the basis of the strain engineering in a modern process.

Since holes… Read More


System Reliability Audits

System Reliability Audits
by Paul McLellan on 07-25-2013 at 12:09 pm

How reliable is your cell-phone? Actually, you don’t really care. It will crash from time to time due to software bugs and you’ll throw it away after two or three years. If a few phones also crash due to stray neutrons from outer space or stray alpha particles from the solder balls used in the flip-chip bonding then nobody… Read More


From Layout Sign-off to RTL Sign-off

From Layout Sign-off to RTL Sign-off
by Pawan Fangaria on 07-25-2013 at 5:00 am

This week, I had a nice opportunity meeting Charu Puri, Corporate Marketing and Sushil Gupta, V.P. & Managing Director at Atrenta, Noida. Well, I know Sushil since 1990s; in fact, he was my manager at one point of time during my job earlier than Cadence. He leads this large R&D development centre, consisting about 200 people… Read More


Semicon: Multiple Patterning vs EUV, round #2

Semicon: Multiple Patterning vs EUV, round #2
by Paul McLellan on 07-24-2013 at 9:00 pm

Round #1 was here.

In the EUV corner were Stefan Wurm of Sematech (working on mask issues mostly) and Skip Miller of ASML who are the only company making EUV steppers (and light sources, they acquired Cymer).

You may know that the biggest issue in EUV is getting the source brightness to have high enough energy that an EUV stepper has … Read More


Metastability Starts With Standard Cells

Metastability Starts With Standard Cells
by Daniel Nenni on 07-24-2013 at 8:05 pm

Metastability is a critical SoC failure mode that occurs at the interface between clocked and clockless systems. It’s a risk that must be carefully managed as the industry moves to increasingly dense designs at 28nm and below. Blendics is an emerging technology company that I have been working with recently, their MetaACERead More


TSMC Q2 Results: Up 17%; 20nm and 16nm on track

TSMC Q2 Results: Up 17%; 20nm and 16nm on track
by Paul McLellan on 07-24-2013 at 10:47 am

TSMC announced their Q2 financial results yesterday. Revenue was $5.2B (at the high end of guidance) with net income of $1.6B. This is up 17.4% on Q1 and up 21.6% year-to-year. Gross margin is up too, at 49% which is up 3.2 points on Q1 and 0.3 points year-to-year. As usual the financial results are not directly that interesting since… Read More


Debugging Verification Constraints

Debugging Verification Constraints
by Paul McLellan on 07-23-2013 at 3:44 pm

In his DAC keynote last year (2012) Mike Mueller of ARM compared how much CPU was required to verify the first ARM versus one of the latest ARM Cortex CPUs. Of course the newer CPU is hundreds of times larger than the first ARM but the amount of verification required was millions of times as much, requiring ARM to construct their own datacenter… Read More


Around the World in 80 Engineers…Actually Well Over 200

Around the World in 80 Engineers…Actually Well Over 200
by Paul McLellan on 07-23-2013 at 12:19 pm

Atrenta today announced Dr Ajith Pasqual, who is the Head of the Department of Electronic & Telecommunication Engineering at the University of Moratuwa in Sri Lanka (which used to be known as Ceylon) has joined Atrenta’s technical advisory board (TAB). OK, academics join EDA company’s TABs all the time so that’s… Read More


Efficient Power Analysis and Reduction at RTL Level

Efficient Power Analysis and Reduction at RTL Level
by Pawan Fangaria on 07-22-2013 at 12:30 am

It’s a classic and creative example of design and EDA tool community getting together, exploiting tool capabilities and developing flows which add value to all stake holders including the end consumer. We know power has become extremely important for battery life in smart phones, high performance servers, workstations, notebooks… Read More


Semicon: Multiple Patterning vs EUV, round #1

Semicon: Multiple Patterning vs EUV, round #1
by Paul McLellan on 07-21-2013 at 9:01 pm

If you want to know the state of play in lithography, there is no better place than the special session on lithography at Semicon West. This year was no exception. The session was given the punchy title Still a tale of 2 paths: multi-patterning lithography at 20nm and below: EUVL source and infrastructure progress.

In the blue corner… Read More