Semiconductor equipment spending beginning to decline

Semiconductor equipment spending beginning to decline
by Bill Jewell on 09-25-2011 at 7:41 pm

Semiconductor manufacturing equipment shipments have leveled off after a strong rebound from the 2008-2009 downturn. August 2011 three-month-average shipments based on combined data from SEMI (North American and European companies) and SEAJ (Japanese companies) were $2.9 billion, down from a peak of $3.2 billion in May Read More


Nanometer Circuit Verification: The Catch-22 of Layout!

Nanometer Circuit Verification: The Catch-22 of Layout!
by Daniel Nenni on 09-19-2011 at 8:00 pm

As analog and mixed-signal designers move to very advanced geometries, they must grapple with more and more complex considerations of the silicon. Not only do nanometer CMOS devices have limitations in terms of analog-relevant characteristics such gain and noise performance, but they also introduce new sources of variation… Read More


Fast Track Seminars

Fast Track Seminars
by Paul McLellan on 09-15-2011 at 6:11 pm


Atrenta’s SoC realization seminars, “Fast Track Your SoC Design” have started.The first one was in Ottowa last Tuesday, and it was a full house. In a straw poll, most of the attendees acknowledged facing IP handoff and quality issues. The keynote speaker was Dr Yuejian Wu, director of ASIC development at Infinera… Read More


When analog/RF/mixed-signal IC design meets nanometer CMOS geometries!

When analog/RF/mixed-signal IC design meets nanometer CMOS geometries!
by Daniel Nenni on 09-13-2011 at 9:22 am

In working with TSMC and GlobalFoundries on AMS design reference flows I have experienced first hand the increasing verification challenges of nanometer analog, RF, and mixed-signal circuits. Tools in this area have to be both silicon accurate and blindingly fast! Berkeley Design Automation is one of the key vendors in this … Read More


2.5D and 3D designs

2.5D and 3D designs
by Paul McLellan on 09-07-2011 at 1:54 pm

Going up! Power and performance issues, along with manufacturing yield issues, limit how much bigger chips can get in two dimensions. That, and the fact that you can’t manufacture two different processes on the same wafer, mean that we are going up into the third dimension.

The simplest way is what is called package-in-package… Read More


Global Technology Conference 2011

Global Technology Conference 2011
by Paul McLellan on 08-31-2011 at 7:07 pm

I went to the second Global Technology Conference yesterday. It started with a keynote by Ajit Manocha who is the CEO of about 2 months. I hadn’t realized until someone asked him during the press lunch that he is technically only the “acting” CEO. Actually, given his experience he might be the right person anyway,… Read More


Economic news not all bad for semiconductors

Economic news not all bad for semiconductors
by Bill Jewell on 08-30-2011 at 2:06 pm



The economic news lately has been bleak. U.S. GDP grew at an anemic 0.4% in 1Q 2011 and 1.0% in 2Q 2011 – leading to increased concerns about a double-dip recession. High government debt levels in the U.S. and several European nations have contributed to volatile stock markets. The news does not seem to be any better for the semiconductorRead More


Nanometer Circuit Verification Forum

Nanometer Circuit Verification Forum
by Daniel Nenni on 08-29-2011 at 2:33 pm

Verifying circuits on advanced process nodes has always been difficult, and it’s no easier with today’s nanometer CMOS processes. There’s a great paradox in nanometer circuit design and verification. Designers achieve their greatest differentiation when they implement analog, mixed-signal, RF and custom … Read More


Third Generation DFM Flow: GLOBALFOUNDRIES and Mentor Graphics

Third Generation DFM Flow: GLOBALFOUNDRIES and Mentor Graphics
by Daniel Payne on 08-26-2011 at 11:17 am

calibre yield analyzer

Introduction
Mentor Graphics and GLOBALFOUNDRIES have been working together for several generations since the 65nm node on making IC designs yield higher. Michael Buehler-Garcia, director of Calibre Design SolutionsMarketing at Mentor Graphics spoke with me by phone today to explain how they are working with GLOBALFOUNDRIESRead More


20nm SoC Design

20nm SoC Design
by Paul McLellan on 08-25-2011 at 12:48 am

There are a large number of challenges at 20nm that didn’t exist at 45nm or even 32nm.

The biggest issues are in the lithography area. Until now it has been possible to make a reticle using advanced reticle enhacement technology (RET) decoration and have it print. Amazing when you think that at 45nm we are making 45nm features… Read More