Remember? During DAC2013 I talked about a new kind of innovation: A Virtual Fabrication Platform, SEMulator3D, developed by COVENTOR. Now, to my pleasant surprise, there is something to report on the proven results from this platform. IBM, in association with COVENTOR, has successfully implemented a 3D Virtual Fabrication… Read More
Layout editing is a complex task, traditionally done manually by designers, and the layout design productivity largely depends on the designer’s skills and expertise. However, a good tool with features for ease of design is a must. Layout productivity has been an area of focus and various features are constantly being added in… Read More
You can only design and optimize for low-power SoC designs if you can actually simulate the entire Chip, Package and System together. The engineers at ANSYS-Apachehave figured out how to do that and talked about their design for power methodology in a webinar today. I listened to Arvind Shanmugavel present a few dozen slides and… Read More
IP is the center of the semiconductor universe and nobody knows this better than Design and Reuse. The D&R website was launched in 1997 targeting the emerging commercial semiconductor IP market. Today, with more than 15,000 IP/SOC product descriptions updated daily, D&R is the #1 IP site matching customer requirements… Read More
Here, I am talking about reliability of chip design in the context of electrical effects, not external factors like cosmic rays. So, the electrical factors that could affect reliability of chips could be excessive power dissipation, noise, EM (Electromigration), ESD (Electrostatic Discharge), substrate noise coupling and… Read More
Estimating the MTBF of an SoC should always include an analysis of synchronizer reliability. Contemporary process nodes are introducing new challenges to the reliability of clock domain crossings so it is prudent to revisit how your simulation tool calculates a synchronizer’s MTBF. Let’s list the ten most common pitfalls.… Read More
For several decades now consumers like me have enjoyed using mobile devices including:
I think by now all of us know, or have heard about 20nm process node, its PPA (Power, Performance, Area) advantages and challenges (complexity of high design size and density, heterogeneity, variability, stress, lithography complexities, LDEs and so on). I’m not going to get into the details of these challenges, but will ponder… Read More
Last month I blogged about CircuitLaband received some two dozen comments, so clearly there is keen interest in using web-based tools for electronic circuit design and using the cloud to save designs plus run simulations. Today I’m reporting on TINACloud, provided by a company called DesignSoft. … Read More
This year for DAC, Calypto has assembled an impressive lineup of customer presentation, suite sessions and Designer Tracks. To start with customer presentation, Steve Kommrusch, Fellow Design Engineer from AMD will be giving a talk in the Calypto Suite on AMD’s methodology for low power and will show how AMD was able to get further… Read More
