Advanced Packaging Conference (APC) 2024

Advanced Packaging Conference (APC) 2024
by Admin on 07-23-2024 at 8:30 pm

Chiplets and Heterogenous Integration: The Next Frontier in Performance and Efficiency

Innovation and Collaboration: New types of Neural Networks (Large Language Models), such as ChatGPT and other text generator, as well as Artificial Intelligence (AI) applications of different kind, are pushing the demands for High Performance… Read More


ESD Alliance CEO Outlook Features Powerhouse Lineup

ESD Alliance CEO Outlook Features Powerhouse Lineup
by Bob Smith on 05-09-2019 at 2:00 pm

Just two more weeks before the 2019 CEO Outlook Thursday, May 23, at SEMI. If you haven’t registered yet, do so today. We’re expecting a full house as a result of our powerhouse lineup and networking opportunities.

That lineup includes Ed Sperling, editor in chief of Semiconductor Engineering, who will serve as moderator. Panelists… Read More


The ESD Alliance Welcomes You to an Evening with Jim Hogan and Paul Cunningham

The ESD Alliance Welcomes You to an Evening with Jim Hogan and Paul Cunningham
by Bob Smith on 04-05-2019 at 7:00 am

An informal “Fireside Chat” like no other featuring Jim Hogan, managing partner of Vista Ventures, LLC., and Paul Cunningham, Cadence’s corporate vice president and general manager of the system verification group, is in the works for Wednesday, April 10.

Hosted by the ESD Alliance, a SEMI Strategic Association Partner, at … Read More