High Performance Ecosystem for 14nm-FinFET ASICs with 2.5D Integrated HBM2 Memory

High Performance Ecosystem for 14nm-FinFET ASICs with 2.5D Integrated HBM2 Memory
by Mitch Heins on 02-07-2018 at 10:00 am


High Bandwidth Memory (HBM) systems have been successfully used for some time now in the network switching and high-performance computing (HPC) spaces. Now, adding fuel to the HBM fire, there is another market that shares similar system requirements as HPC and that is Artificial Intelligence (AI), especially AI systems doing… Read More


Arm TechCon Preview with the Foundries!

Arm TechCon Preview with the Foundries!
by Daniel Nenni on 10-23-2017 at 9:00 am

This week Dr. Eric Esteve, Dr. Bernard Murphy, and I will be blogging live from Arm TechCon. It really looks like it will be a great conference so you should see some interesting blogs in the coming days. One of the topics I am interested in this year is foundation IP and I will tell you why.

During the fabless transformation of the semiconductor… Read More


Layout Pattern Matching for DRC, DFM, and Yield Improvement

Layout Pattern Matching for DRC, DFM, and Yield Improvement
by Tom Dillinger on 06-01-2016 at 12:00 pm

It is truly amazing to consider the advances in microelectronic process development, using 193i photolithography. The figure below is a stark reminder of the difference between the illuminating wavelength and the final imaged geometries. This technology evolution has been enabled by continued investment in mask data generation… Read More


Samsung 10nm and 7nm Strategy Explained!

Samsung 10nm and 7nm Strategy Explained!
by Daniel Nenni on 04-23-2016 at 7:00 am

Samsung Foundry had an intimate gathering recently for 200 customers and partners that I missed, but I know several people who attended. This event was a precursor to #53DAC where Samsung has the largest foundry presence. I was able to clarify what I had heard via a phone call with Kelvin Low so here is my version of what is important:… Read More


SoC and Foundry Update 2H 2015!

SoC and Foundry Update 2H 2015!
by Daniel Nenni on 09-01-2015 at 10:00 pm

Rarely do I fly first class but I did on my recent trip to Asia. It was one of the new planes with pod-like seats that transforms into a bed. The flight left SFO at 1 A.M. so I fell asleep almost immediately missing the first gourmet meal. About half way through the flight I found myself barely awake staring straight up and what do I see? STARS!… Read More


eSilicon@Samsung: ASIC Design, IP Enablement, and Cloud Platform

eSilicon@Samsung: ASIC Design, IP Enablement, and Cloud Platform
by Paul McLellan on 06-12-2015 at 7:00 am

Earlier this week at DAC, Javier DeLaCruz of eSilicon presented at the Samsung booth. They presented an introduction to what eSilicon does. However, since what they do has changed over the years it is useful to recap. If you know about eSilicon then you probably think of them as a fabless ASIC company. The old ASIC model back in the … Read More


Samsung Foundry Debuts 10nm Wafer!

Samsung Foundry Debuts 10nm Wafer!
by Daniel Nenni on 05-22-2015 at 1:00 pm

The Samsung Smart, Connected Lifestyle event was last night at the Bently Reserve in San Francisco. Getting into San Francisco was no picnic with all of the roadwork and new building construction. We even saw people drive up on the sidewalk to get around car clogs. It really was crazy but definitely worth it after seeing the first … Read More


Samsung Foundry Update!

Samsung Foundry Update!
by Daniel Nenni on 05-13-2015 at 11:00 pm

It is hard to believe that Samsung is celebrating their 10[SUP]th[/SUP] anniversary in the foundry business this year. It certainly has not been an easy road but as of late you cannot argue with the results. Samsung is the first foundry to put 14nm silicon into smart phones, beating the #1 semiconductor company (Intel) and the #1 … Read More