A Recipe for Performance Optimization in Arm-Based Systems

A Recipe for Performance Optimization in Arm-Based Systems
by Bernard Murphy on 05-16-2024 at 6:00 am

Performance cookbook for Arm min (1)

Around the mid-2000’s the performance component of Moore’s Law started to tail off. That slack was nicely picked up by architecture improvements which continue to march forward but add a new layer of complexity in performance optimization and verification. Nick Heaton (Distinguished Engineer and Verification Architect at… Read More


Webinar: Digital Twin for Multi-physics Systems – How to Verify and Optimize Performance at the Overall Product Level

Webinar: Digital Twin for Multi-physics Systems – How to Verify and Optimize Performance at the Overall Product Level
by Admin on 03-25-2024 at 2:24 pm

Ensuring reliable performance of products in the field requires verification and validation at the system level. This means considering the complex interaction of different physics between systems and sub-systems. In this webinar, you will learn about purpose-driven digital twins that can:

  • Optimize performance at the system
Read More

Expedera Proposes Stable Diffusion as Benchmark for Edge Hardware for AI

Expedera Proposes Stable Diffusion as Benchmark for Edge Hardware for AI
by Bernard Murphy on 02-05-2024 at 6:00 am

Stable diffusion image min

A recent TechSpot article suggests that Apple is moving cautiously towards release of some kind of generative AI, possibly with iOS 18 and A17 Pro. This is interesting not just for Apple users like me but also for broader validation of a real mobile opportunity for generative AI. Which honestly had not seemed like a given, for multiple… Read More


Breakthrough Gains in RTL Productivity and Quality of Results with Cadence Joules RTL Design Studio

Breakthrough Gains in RTL Productivity and Quality of Results with Cadence Joules RTL Design Studio
by Kalar Rajendiran on 08-08-2023 at 10:00 am

Joules RTL Design Studio Benefits

Register Transfer Level (RTL) is a crucial and valuable concept in digital hardware design. Over the years, it has played a fundamental role in enabling design of complex digital chips. By abstracting away implementation details and providing a clear description of digital behavior, RTL has contributed significantly to the… Read More


Quadric’s Chimera GPNPU IP Blends NPU and DSP to Create a New Category of Hybrid SoC Processor

Quadric’s Chimera GPNPU IP Blends NPU and DSP to Create a New Category of Hybrid SoC Processor
by Kalar Rajendiran on 11-01-2022 at 10:00 am

Memory Optimization Equals Power Minimization

Performance, Power and Area (PPA) are the commonly touted metrics in the semiconductor industry placing PPA among the most widely used acronyms relating to chip development. And rightly so as these three metrics greatly impact all electronic products that are developed. The degree of impact depends of course on the specific … Read More


NoC-Based SoC Design. A Sondrel Perspective

NoC-Based SoC Design. A Sondrel Perspective
by Bernard Murphy on 08-03-2022 at 6:00 am

NoC optimization min

Why are NoCs important in modern SoCs and what are best design practices for using NoC? As always, a great place to start is the perspective of an SoC design organization which depends on pumping out high performance designs. Sondrel is a turnkey ASIC service provider, covering the spectrum from system design to silicon supply. … Read More


A Next-Generation Prototyping System for ASIC and Pre-Silicon Software Development

A Next-Generation Prototyping System for ASIC and Pre-Silicon Software Development
by Kalar Rajendiran on 12-05-2021 at 6:00 am

Corigine Prototyping Systems

Every now and then, disruptive technology is brought to market, challenging the way things have been done to that point. We are all familiar with many such technologies. The rhetorical question is, how many of us were aware, recognized and acknowledged those technologies before they became well established? For example, a startup… Read More


Optimizing High Performance Packages calls for Multidisciplinary 3D Modeling

Optimizing High Performance Packages calls for Multidisciplinary 3D Modeling
by Tom Simon on 10-16-2019 at 10:00 am

For all the time we spend thinking and talking about silicon design, it’s easy to forget just how important package design is. Semiconductor packages have evolved over the years from very basic containers for ICs into very specialized and highly engineered elements of finished electronic systems. They play an important role … Read More


Embeddable FPGA Fabric on TSMC 7nm

Embeddable FPGA Fabric on TSMC 7nm
by Tom Simon on 12-14-2018 at 7:00 am

With their current line-up of embeddable and discrete FPGA products, Achronix has made a big impact on their markets. They started with their Speedster FPGA standard products, and then essentially created a brand-new market for embeddable FPGA IP cores. They have just announced a new generation of their Speedcore embeddable… Read More


Making AI Silicon Smart with PVT Monitoring

Making AI Silicon Smart with PVT Monitoring
by Tom Simon on 11-26-2018 at 7:00 am

PVT – depending on what field you are in those three letters may mean totally different things. In my undergraduate field of study, chemistry, PVT meant Pressure, Volume & Temperature. Many of you probably remember PV=nRT, the dreaded ideal gas law. However, anybody working in semiconductors knows that PVT stands … Read More