In the earliest days of IC design the engineering work was always done at the transistor-level, and then over time the abstraction level moved upward to gate-level, cell-level, RTL level, IP reuse, and high-level modeling abstractions. The higher levels of abstraction have allowed systems to be integrated into an SoC that can… Read More
I caught up with John Ferguson of Mentor Graphics this week to learn more about a recent announcement that TSMC has extended its collaboration with Mentor in the area of Fan-Out Wafer Level Processing (FOWLP).
In March of last year Mentor and TSMC announced that they were collaborating on a design and verification flow for TSMC’s… Read More
It’s hard to believe but this is DesignCon #22 and being a Silicon Valley conference I have attended my fair share of them. This year it seems like high speed communications will take the lead followed by the latest on PCB design tools, power and signal integrity, jitter and crosstalk, test and measurement tools, parallel … Read More
ARM has become such a worldwide powerhouse in delivering processors to the semiconductor IP market because they have done so many things well: IP licensing model, variety, performance, and low-power. On my desk are two devices with ARM IP, a Samsung Galaxy Note 4 smart phone and a Google tablet. Most of my readers will likely have… Read More
A few weeks back I wrote an article mentioning that Mentor Graphics has been quietly working on solutions for photonic integrated circuits (PICs) for some time now, while one of their competitors has recently established a photonics beachhead. One of the most common challenges for PIC designs is their curvilinear nature, thus… Read More
For decades, digital test has been fully automated including methodologies and automation for test pattern generation, grading and test time compression. Automation for analog and mixed-signal (AMS) IC test has not however kept pace. This is troubling as according to IBSapproximately 85% of SoC design starts are now AMS designs.… Read More
IoT edge device design means four domains – MEMS, analog, digital, and RF – not only work together, but often live on the same die (or substrate in a 2.5D process) and are optimized for power and size. Getting these domains to work together effective calls for an enhanced flow.
Historically, these domains have not played together … Read More
Anybody who has done any bus & board system design knows the problem. Merchant boards typically have standardized pinouts (after years of haggling in standards organizations) for the backplane bus, and a group of user-defined pins for daughtercard I/O. Homegrown systems usually have a just-as-carefully defined proprietary… Read More
In the early days of IC design there were arguments against using any extra transistors or gates for testability purposes, because that would be adding extra silicon area which in turn would drive up the costs of the chip and product. Today we are older and wiser, realizing that there are product pricing benefits to quickly test each… Read More
Next week is ARM TechCon and I’m extra excited about this one because of the SoftBank acquisition. In fact, the opening keynote says it all. ARM CEO Simon Segar and SoftBank CEO Masayoshi Son will discuss the next chapter in the book of ARM. To better prepare for this keynote you should probably read our book “Mobile Unleashed: The … Read More
