How to Assure Quality of Power and SI Verification?

How to Assure Quality of Power and SI Verification?
by Pawan Fangaria on 12-08-2013 at 10:05 am

As power has become one of the most important criteria in semiconductor design today, I was wondering whether there is a standard set for the power verification for an overall chip. We do have formats evolved like CPF and UPF and there are tools available to check power and signal integrity (SI), however I don’t see a standard objective… Read More


Best Practices for Using DRC, LVS and Parasitic Extraction – on YouTube

Best Practices for Using DRC, LVS and Parasitic Extraction – on YouTube
by Daniel Payne on 07-10-2013 at 1:21 pm

EDA companies produce a wealth of content to help IC engineers get the best out of their tools through several means:

  • Reference Manuals
  • User Guides
  • Tutorials
  • Workshops
  • Seminars
  • Training Classes
  • Phone Support
  • AE visits
Read More

Improving Design Practices for an Image Sensor IDM

Improving Design Practices for an Image Sensor IDM
by klujan on 05-07-2013 at 8:30 pm

With nearly twenty five years in business, Tanner EDA Application Engineers have seen a wide range of support requests. One consistent topic area is around design data management and design reuse. In one recent instance, our customer, an IDM who produces imaging sensors for infrared vision systems, called on Tanners AE team for… Read More


Design-to-Silicon Platform Workshops!

Design-to-Silicon Platform Workshops!
by Daniel Nenni on 07-17-2012 at 7:30 pm

Have you seen the latest design rule manuals? At 28nm and 20nm design sign-off is no longer just DRC and LVS. These basic components of physical verification are being augmented by an expansive set of yield analysis and critical feature identification capabilities, as well as layout enhancements, printability, and performance… Read More


Speeding SoC timing closure

Speeding SoC timing closure
by Paul McLellan on 01-12-2012 at 1:42 am

As chips have become larger, one of the more challenging steps is full-chip signoff. Lots of other steps in the design process can work on just a part of the problem, but by definition full-chip signoff has to work on the full chip. But it is not just that chips have got larger, the number of corners that need to be validated has also exploded.… Read More


Aug 25th in Fremont, CA – Hands on Calibre workshop: DRC, LVS, xRC, ERC, DFM

Aug 25th in Fremont, CA – Hands on Calibre workshop: DRC, LVS, xRC, ERC, DFM
by Daniel Payne on 08-18-2011 at 10:30 am

I’ve blogged about the Calibre family of IC design tools before:

Smart Fill replaced Dummy Fill Approach in a DFM Flow
DRC Wiki
Graphical DRC vs Text-based DRC
Getting Real time Calibre DRC Results with Custom IC Editing
Transistor-level Electrical Rule Checking
Who Needs a 3D Field Solver for IC Design?
Prevention is BetterRead More