I just did a Google search for “3D IC”, and was stunned to see it return a whopping 476,000 results. This topic is trending, because more companies are using advanced IC packaging to meet their requirements, and yet the engineers doing the 3D IC design have new challenges to overcome. One of those challenges is creating… Read More
The capacity and energy efficiency challenges from the growing appetite for high-speed data along with advanced applications such as LIDAR and quantum computing are driving demand for increasingly large-scale photonic integrated circuits (PIC). With an ever-increasing number of components on a single photonic chip, manual… Read More
A decade ago, many of us heard commentaries on how entrepreneurs were turned down by venture capitalists for not including a cloud strategy in their business plan, no matter what the core business was. Humorous punchlines such as, “It’s cloudy without any clouds” and “Add some cloud to your strategy and your future will be bright… Read More
This area of automating the design of Flat Panel Displays (FPD) is so broad that it has taken me three blogs to cover all of the details, so in brief review the first two blogs were:
My final blog covers five areas:
Innovations in packaging have played an important role in improving system performance and area utilization. Advances like 2.5D interposers and fan-out wafer-level packaging (FOWLP) have allowed mixed dies to be used in a single package and have dramatically reduced the number of connections that need to go all the way to the… Read More
Design process retargeting is acommon recurrence based on scaling orBOM(Bill-Of-Material) cost improvement needs. This occursnot only with the availability of foundry process refresh to a more advanced node,but also to any new derivative process node tailored towards matching design complexity, power profile or reliability… Read More
Being new in Ottawa and trying to get some momentum towards automation in full custom layout I was telling industry people that I am interested to work with everybody to move this agenda forward. My Director of Engineering at that time, Peter Gillingham, took me to visit Carleton University in Ottawa. One of his professor friends,… Read More
Back in the day the Dracula tool from Cadence was king of the DRC and LVS world for physical IC verification, however more recently we’ve seen Calibre from Mentor Graphics as the leader in this realm. Cadence wanted to reclaim their earlier prominence in physical verification so they had to come out with something different… Read More
A few weeks back I wrote an article mentioning that Mentor Graphics has been quietly working on solutions for photonic integrated circuits (PICs) for some time now, while one of their competitors has recently established a photonics beachhead. One of the most common challenges for PIC designs is their curvilinear nature, thus… Read More
If you don’t get the tongue in cheek reference of the title, you probably don’t have children who liked to watch Disney movies. All four of my daughters loved Disney and so, I am forever shaped by the Wonderful World of Disney. In 2007 Disney adapted to the screen a novel called, ‘A Bridge to Terabithia’, in which two adolescents escape… Read More
