Semicon Technology Advancement – A View From IEDM

Semicon Technology Advancement – A View From IEDM
by Pawan Fangaria on 12-20-2013 at 10:00 am

As I see the semiconductor industry going through significant changes and advances, yet ironically plagued by a growing perception that the pace of scaling is slowing, I was inclined to take a peek into what the industry experts say about the state of the industry and the future of Moore’s Law. Fortunately, at last week’s InternationalRead More


Please Help Me Understand IBM – Common Platform Technology Forum 2013

Please Help Me Understand IBM – Common Platform Technology Forum 2013
by Zvi on 02-08-2013 at 11:00 pm

“Innovations for Next Generation Scaling”

The 2013 Forum today (Feb 5, 2013) started with a presentation by Dr. Gary Patton, VP, IBM Semiconductor Research & Development Center. Gary very clearly articulated the two irresolvable challenges the industry now faces:

  • On chip interconnect
  • Lithography

These … Read More


Wafer Costs: Out of Control or Not?

Wafer Costs: Out of Control or Not?
by Paul McLellan on 01-01-2013 at 8:30 pm

I didn’t attend the International Electronic Device Meeting (IEDM) earlier this month, but there have been a lot of reports on the inter webs especially about 20nm and 14nm processes. Some of this is really geeky stuff but I think that perhaps the most interesting thing I’ve read about is summarized in this chart:

This… Read More


ReRAM/CBRAM at the 2012 IEDM Conference

ReRAM/CBRAM at the 2012 IEDM Conference
by Ed McKernan on 10-02-2012 at 8:10 pm


Time flies! IEDM time is coming up again (this year on the left coast) and the conference program is now on-line. Lots of interest to the ReRAM/CBRAM community. While some trends are emerging (Hafnium Oxide appears to be the material of choice) there are still plenty of other more contentious issues. ReRAM/CBRAM has reached the … Read More