3D ESD verification: Tackling new challenges in advanced IC design

3D ESD verification: Tackling new challenges in advanced IC design
by Admin on 12-17-2025 at 10:00 am

fig1 3d structures

By Dina Medhat

Three key takeaways

  • 3D ICs require fundamentally new ESD verification strategies. Traditional 2D approaches cannot address the complexity and unique connections in stacked-die architectures.
  • Classifying external and internal IOs is essential for robust and cost-efficient ESD protection. Proper differentiation
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Protect against ESD by ensuring latch-up guard rings

Protect against ESD by ensuring latch-up guard rings
by Admin on 10-13-2025 at 10:00 am

fig1 latchup event

By Mark Tawfik

Overview: Protecting ICs from costly ESD and latch-up failures

Electrostatic discharge (ESD) events cost the semiconductor industry an estimated $8 billion annually in lost productivity, warranty claims and product failures [1].

Ensuring the robust protection of integrated circuits (ICs) against various… Read More


Semitracks Course: EOS, ESD and How to Differentiate

Semitracks Course: EOS, ESD and How to Differentiate
by Admin on 06-24-2025 at 9:13 am

Electrical Overstress (EOS) and Electrostatic Discharge (ESD) account for most of the field failures observed in the electronics industry. Although EOS and ESD damage can at times look quite similar to each other, the source each and the solution can be quite different. Therefore, it is important to be able to distinguish between… Read More


Electrical Rule Checking in PCB Tools

Electrical Rule Checking in PCB Tools
by Daniel Payne on 12-10-2024 at 10:00 am

HyperLynx DRC min

I’ve known about DRC (Design Rule Checking) for IC design, and the same approach can also be applied to PCB design. The continuous evolution of electronics has led to increasingly intricate PCB designs that require Electrical Rule Checking (ERC) to ensure that performance goals are met. This complexity poses several challenges… Read More


Aniah and Electrical Rule Checking (ERC) #61DAC

Aniah and Electrical Rule Checking (ERC) #61DAC
by Daniel Payne on 08-06-2024 at 10:00 am

Aniah #61DAC min

Visiting a new EDA vendor at #61DAC is always a treat, because much innovation comes from the start-up companies, instead of the established big four EDA companies. I met with Vincent Bligny, Founder and CEO of Aniah on Wednesday in their booth, to hear about what they are doing differently in EDA. Mr. Bligny has a background working… Read More


EP177: The Certus Approach to Meeting the Challenges of I/O and ESD with Stephen Fairbanks

EP177: The Certus Approach to Meeting the Challenges of I/O and ESD with Stephen Fairbanks
by Daniel Nenni on 08-18-2023 at 10:00 am

Dan is joined by Stephen Fairbanks, CEO of Certus Semiconductor. Stephen is an ESD pioneer with over 30 years of experience starting with his time at Intel, SRF Technologies, and now Certus Semiconductor.

Stephen describes the varied challenges of ESD andI/O library design presented by today’s technologies and design… Read More


Unique IO & ESD Solutions @ DAC 2023!

Unique IO & ESD Solutions @ DAC 2023!
by Daniel Nenni on 06-29-2023 at 6:00 am

DAC photo Certus Semiconductor

The semiconductor industry continues to drive innovation and constantly seeks methods to lower costs and improve performance. The advantages of custom I/O libraries versus free libraries can be seen as cost-savings or, more importantly, new markets, new customers, and new business
opportunities.

At DAC 2023, Certus SemiconductorRead More


CEO Interview: Stephen Fairbanks of Certus Semiconductor

CEO Interview: Stephen Fairbanks of Certus Semiconductor
by Daniel Nenni on 01-20-2023 at 6:00 am

Stephen Fairbanks headshot 1 1

Trained as a semiconductor Analog and RF Circuit Designer, Stephen Fairbanks has been designing and developing process-specific I/O and ESD libraries for 24 years. His foundational training began while attending Brigham Young University designing highspeed 32 GSPS data acquisition systems and RF interfaces for a time-of-flight… Read More


Bizarre results for P2P resistance and current density (100x off) in on-chip ESD network simulations – why?

Bizarre results for P2P resistance and current density (100x off) in on-chip ESD network simulations – why?
by Maxim Ershov on 12-12-2022 at 6:00 am

Fig 1

Resistance checks between ESD diode cells and pads or power clamps, and current density analysis for such current flows are commonly used for ESD networks verification [1]. When such simulations use standard post-layout netlists generated by parasitic extraction tools, the calculated resistances may be dramatically higher… Read More


Methods for Current Density and Point-to-point Resistance Calculations

Methods for Current Density and Point-to-point Resistance Calculations
by Daniel Payne on 05-26-2022 at 10:00 am

ESD path min

IC reliability is an issue that circuit design engineers and reliability engineers are concerned about, because physical effects like high Current Density (CD) in interconnect layers, or high point-to-point (P2P) resistance on device interconnect can impact reliability, timing or Electrostatic Discharge (ESD) robustness.… Read More