Ceva, Inc., a leading provider of silicon and software IP for the Smart Edge, has unveiled PentaG-NTN™, its groundbreaking 5G Advanced modem IP subsystem tailored for satellite user terminals in Low Earth Orbit (LEO) and Medium Earth Orbit (MEO) constellations. Announced at Mobile World Congress 2026 in Barcelona on March 3,… Read More
As computing expands from data centers to edge devices, semiconductor designers face increasing pressure to optimize both performance and energy efficiency. Advanced process nodes continue to provide transistor-level improvements, but scaling alone cannot meet the demands of hyperscale AI infrastructure or ultra-low-power… Read More
Physical AI is changing how intelligent systems interact with the real world. These systems must sense, process, and respond to data in real time. Unlike cloud AI, Physical AI depends on fast local processing and reliable distributed communication. This shift creates a new challenge. Systems must move large volumes of sensor… Read More
Tell us a little bit about yourself and your company.
I founded TekStart Group in Ontario, Canada, in 1998 with a very clear objective: to help innovators turn breakthrough technology concepts into real, market-ready products. Over the past 25-plus years, we have worked across the full lifecycle of technology development, from… Read More
It is well-known that semiconductor growth is driven by AI. That simple statement breaks down into many complex use cases, each with its own requirements and challenges. A webinar will be presented by Synopsys on October 23 that focuses on the specific requirements for one of the most popular use cases – AI at the edge. The speaker… Read More
Synopsys recently held a webinar session on this topic and Gustavo Pimentel, Principal Product Marketing Manager at the company led the webinar session. Going into the webinar session, I found myself wondering: why focus on PCIe 5.0, eight years after its release? With the industry buzzing about Edge AI, cloud computing, and … Read More
The AI Infra Summit is the premier full-stack AI Infrastructure conference, arranged in a modular way that equally enables both enterprises and technology/solution providers to benefit from domain-specific content, all while doing business on the exhibition floor. Our 4 track event is divided
Dan is joined by Moshe Sheier, Ceva’s vice president of marketing. Moshe brings with him more than 20 years of experience in the semiconductor IP and chip industries in both development and managerial roles. Prior to this position, Mr. Sheier was the director of strategic marketing at Ceva.
Dan explores the history of Ceva with … Read More
In an era where artificial intelligence workloads are growing in scale, complexity, and diversity, chipmakers are facing increasing pressure to deliver solutions that are not only fast, but also flexible and programmable. Semidynamics recently announced Cervell™, a fully programmable Neural Processing Unit (NPU) designed… Read More
Dan is joined by GP Singh, CEO of Ambient Scientific. With over 20 years of experience, GP has played a pivotal role in shaping the industry, driving 50+ chip tapeouts, including game-changing advancements at FinFET technology nodes. Now, as the CEO of Ambient Scientific, GP brings together hands-on engineering expertise and… Read More
