Analog Mixed-Signal (AMS) behavioral models have not caught on with the AMS designer community. Why? I suspect a significant reason (but certainly not the only one) is the way they are presented.
First, what is AMS behavioral modeling?
I define it as “a set of user-defined equations that decribe the terminal behavior of a component”.… Read More
Modern SoC (System On Chip) designs contain a larger number of RAM (Random Access Memory) instances, so how do you know what the speed, timing and power are for any instance? There are a couple of approaches:
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At ICCAD earlier this week, CEDA sponsored a talk by Alberto Sangiovanni-Vincentelli looking back over the last 30 years (it is the 30th anniversary of ICCAD) and looking to the future. As is always the case in these sorts of presentations, the retrospective contained a lot more detail than the going forward part. Clayton Christensen… Read More
Solido Design Automation and TSMC recently published an article in EE Times describing how Solido’s High-Sigma Monte Carlo tool is used with TSMC PDK’s to achieve high-yield, high-performance memory design. This project has been a big part of my life for the past three years and it is time for a victory lap!
In TSMC 28nm, 20nm and … Read More
The common theme amongst semiconductor ecosystem conferences this year is FinFETS, probably the most exciting technology we will see this decade. A lot has been written on SemiWiki about FinFETS, it is one of the top trending search terms, but there is some confusion about the process naming so let me attempt to explain.
In planar… Read More
Our EDA industry loves three letter acronyms so credit the same industry for creating a five letter acronym CoWoS. Two weeks ago TSMC announced tape-out of their first CoWoS test chip integrating with JEDEC Wide I/O mobile DRAM interface, making me interested enough to read more about it. At the recent TSMC Open Innovation Platform… Read More
Electromigration (EM) is a reliability concern for IC designers because a failure in the field could spell disaster as in lost human life or even bankruptcy for a consumer electronics company. In the old days of IC design we would follow a sequential and iterative design process of:… Read More
Just in time for the Jasper User Group meeting, Jasper have a new white paper explaining the concept of JasperGold Apps.
First the User Group Meeting. It is in Cupertino at the Cypress Hotel November 12-13th. For more details and to register, go here. The meeting is free for qualified attendees (aka users). One thing I noticed at the… Read More
On Halloween, Atrenta and TSMC announced the availability of SpyGlass IP Kit 2.0. IP Kit is a fundamental element of TSMC’s soft IP9000 Quality Assessment program that assesses the robustness and completeness of soft (synthesizable) IP.
IP Kit 2.0 will be fully supported on TSMC-Online and available to all TSMC’s soft IP alliance… Read More
An announcement at the ARM conference was of a joint project to tape out an ARM Cortex-M0 in IBM’s 14nm FinFET process. In fact they taped out 3 different versions of the chip using different routing architectures to see the impact on yield.
This was the first 14nm ARM tapeout, it seems. I’m sure Intel has built plenty … Read More
