Last week I attended the Ansys/Apache seminars on “Dimensions of Electronic Design.” The two big challenges as we go down to 28nm and 20nm and below are keeping power manageable and keeping reliability up.
The big challenge with power is that we can put so much stuff on a die and clock it so fast that the power is exceeding… Read More
Dr. Stanley Hyduke founded Aldecin 1984 and their first product was delivered in 1985, named SUSIE (Standard Universal Simulator for Improved Engineering), a gate-level, DOS-based simulator. The SUSIE simulator was priced lower than other EDA vendor tools from the big three: Daisy, Mentor and Valid (aka DMV). Aldec maintains… Read More
The deadline is coming up at the end of next week (technically on Monday October 29th for those of you who like real brinkmanship) for several aspects of DAC (not submission of papers for the conference itself) but most of the less academic-oriented things.
Proposals for:
Cadence has apparently announced that going forward the Virtuoso environment is going to be split into two and offered as two separate code-streams, the current IC6.x and a new IC12.x. The idea is to introduce a new product with features that were specifically developed for new technologies such as double patterning aware layout… Read More
FPGA-based prototyping brings SoC designers the possibility of a high-fidelity model running at near real-world speeds – at least until the RTL design gets too big, when partitioning creeps into the process and starts affecting the hoped-for results.
The average ASIC or ASSP today is on the order of 8 to 10M gates, and that includes… Read More
There’s a nice article on timing closure by Dr. Jason Xing, Vice President of Engineering at ICScape Inc. on the Chip Design website. Not familiar with ICScape? Paul McLellan called ICScape the The Biggest EDA Company You’ve Never Heard Ofand Daniel Payne did Schematic, IC Layout, Clock and Timing Closure from ICScape at… Read More
SpringSoft, soon to be part of Synopsys but officially still a separate company for now, just announced that Laker[SUP]3[/SUP], the third generation of their layout product family, is featured in TSMC’s 20nm Custom Reference Flow.
Laker 20nm advancements include new double patterning-aware design and voltage-dependent… Read More
My new iPad lasts about 10 hours on a single charge and the A5X processor is designed with a 45nm process from Samsung. Processor chips for tablets like this use a multi-voltage IC design flow to reduce total power by:… Read More
There is an interesting discussion on the LinkedIn SoC Power Integrity Group in regards to the power integrity challenges for high speed and high frequency designs. More specifically, the additional attention an on-chip power delivery network (PDN) requires as the operating frequency of ICs and SoCs increases.
The PDN has to… Read More
At advanced process nodes, variation and its effects on the design become a huge challenge. Join Cadence® Virtuoso® experts for a series of technical webinars on variation-aware design. Learn how to use advanced technologies and tools to analyze and understand the affects of variation. We’ll introduce you to the latest Virtuoso… Read More
