What does 3D IC, FinFETs, and EUV have in common?

What does 3D IC, FinFETs, and EUV have in common?
by Daniel Nenni on 06-19-2013 at 6:00 pm


They are three of the top trending terms on SemiWiki and three of the hot topics at this year’s Semicon West:

In its 43rd year, SEMICON West is the flagship annual event for the global microelectronics industry. It is the premier event for the display of new products and technologies for microelectronics design and manufacturing,Read More


Is Your Synchronizer Doing its Job (Part 1)?

Is Your Synchronizer Doing its Job (Part 1)?
by Jerry Cox on 06-18-2013 at 8:30 pm

Recently, I discussed the increasing risk of metastability hazards at nanoscale geometries. These risks are significantly aggravated at low supply voltages and low temperatures and must be addressed during the design cycle of any mission critical application. This time I discuss what it takes to estimate a synchronizer’s … Read More


Derivative Designs Need Tools Too

Derivative Designs Need Tools Too
by Paul McLellan on 06-18-2013 at 11:58 am

Increasingly, SoC designs consist of assembling blocks of pre-designed IP. One special case is the derivative design where not just the IP blocks get re-used but a lot of the assembly itself. For example, in the design below some blocks are added, some blocks are updated, some hierarchy is changed. But the bulk of the design remains… Read More


Increasing Automotive Semiconductor Test Quality

Increasing Automotive Semiconductor Test Quality
by glforte on 06-17-2013 at 4:45 pm

The growing amount of electronics within today’s automobiles is driving very high quality and reliability requirements to a widening range of semiconductor devices. At the same time, traditional fault models are becoming less effective at achieving desired silicon quality levels. Improvements in test solutions are needed… Read More


Formality Ultra, Streamline Your ECOs

Formality Ultra, Streamline Your ECOs
by Paul McLellan on 06-17-2013 at 8:00 am

One of the most challenging stages in an SoC design is achieving timing closure. Actually design closure is perhaps a better term since everything needs to come together such as clock tree, power nets, power budget and so on. Changes made to the design are known as ECOs (which stands for engineering change orders, a term that comes… Read More


Should You Buy All Aspects of Your IP From a Single Supplier?

Should You Buy All Aspects of Your IP From a Single Supplier?
by Paul McLellan on 06-16-2013 at 9:18 am

Interface IP typically consists of multiple layers, most importantly a PHY (level 1) analog (or mixed signal) block that handles the interface to the outside world and a number of levels of digital controllers. The interfaces between all these levels, especially between the PHY and the controller, is often defined by the interface… Read More


Swap and Play Extended To Chip Fabric and Memory Controllers

Swap and Play Extended To Chip Fabric and Memory Controllers
by Paul McLellan on 06-16-2013 at 9:08 am

Virtual platforms enable software development to take place on a model of an electronic system. What everyone would like is models that are fast and accurate but that is simply not possible. Fast models are fast because they don’t model everything at the signal level. And accurate models get to be accurate by handling a lot of detail… Read More


Missed #50DAC? See Aldec Verification Sessions Online

Missed #50DAC? See Aldec Verification Sessions Online
by Daniel Nenni on 06-13-2013 at 12:00 am

Aldec, Inc. is an industry-leading Electronic Design Automation (EDA) company delivering innovative design creation, simulation and verification solutions to assist in the development of complex FPGA, ASIC, SoC and embedded system designs. With an active user community of over 35,000, 50+ global partners, offices worldwide… Read More


Increase Your Chip Reliability with iROC Tech

Increase Your Chip Reliability with iROC Tech
by Pawan Fangaria on 06-12-2013 at 9:00 pm

As we have moved towards extremely low process nodes with very high chip density, the cost of mask preparation also has become exorbitantly high. It has become essential to know about the failure rates and mitigate the same at the design time before chip fabrication, and also to make sure about chip reliability over time as it is constantly… Read More


Hardware Assisted Verification

Hardware Assisted Verification
by Paul McLellan on 06-10-2013 at 9:00 pm

On the Tuesday of DAC I moderated a panel session on Hardware Assisted Verification in 10 Years: More Need, More Speed. Although this topic obviously could include FPGA-based prototyping, in fact we spent pretty much the whole time talking about emulation. Gary Smith, on Sunday night, actually set up things by pointing out that… Read More