Security All Around in SoCs at DAC

Security All Around in SoCs at DAC
by Pawan Fangaria on 04-06-2015 at 12:00 am

Last month I was on my way to write a detailed article on important aspects to look at while designing an SoC. This was important in the new context of modern SoCs that go much beyond the traditional power, performance and area (PPA) requirements. I had about 12-13 parameters in my list that I couldn’t cover in one go, so I put the write-up… Read More


Know All About ESD and Save Your Chips & Systems

Know All About ESD and Save Your Chips & Systems
by Pawan Fangaria on 08-24-2014 at 7:30 pm

In this age of electronics, especially with so many different types of human held devices and more upcoming wearable devices, it’s utmost important to protect the massive circuitry inside those tiny parts in the devices from ESD related failures. The protection needs to happen at all stages – cells inside the chips, package… Read More


Paving the Path for Robust Electronic System Design

Paving the Path for Robust Electronic System Design
by Pawan Fangaria on 07-13-2014 at 7:30 pm

In today’s era of low power and high performance components, preferably on a single chip provides impetus to much larger electronic systems packaged into much smaller cases; smartphones are the immediate examples which encapsulate multiple functions other than the intended ones, viz. phone and data communication. As an example,… Read More


Fast & Accurate Thermal Analysis of 3D-ICs

Fast & Accurate Thermal Analysis of 3D-ICs
by Pawan Fangaria on 04-14-2014 at 11:00 am

As Moore’s law started saturating on a single semiconductor die, the semiconductor community came up with the approach of growing vertically by stacking dies one above other in a 3D-IC arrangement. However, a major concern with a 3D-IC is that the heat generated by each die can get trapped in the stack, and hence it’s extremely important… Read More


Apache on Signal Integrity

Apache on Signal Integrity
by Paul McLellan on 11-20-2012 at 1:09 pm

Matt Elmore has a two-part blog about the growing complexity of signal integrity analysis, both on the chip itself and the increasingly complex analysis required to make sure that signals (and power) get in and out of the chip from the board cleanly, especially to memory, which requires simultaneous analysis of chip-package-system… Read More


Chip-Package-System Webinar

Chip-Package-System Webinar
by Paul McLellan on 09-14-2012 at 2:47 pm

Aveek Sarkar presented a webinar on chip-package-system (CPS) earlier this summer. One of the big challenges with low-power electronic systems is that the performance, power and price goals are mutually conflicting. It’s like the old joke about “pick any 2”. But for a real system all need to be optimized. … Read More


Power, Signal, Thermal and EMI signoff

Power, Signal, Thermal and EMI signoff
by Paul McLellan on 08-28-2012 at 1:55 pm

Increasingly the challenge with SoCs, especially for mobile, is not getting the performance high enough but doing so in a power-efficient manner. Handheld devices running multiple apps need high-speed processors that consume extremely low levels of power both in operating and standby modes. In the server farm, the limit is … Read More


Chip-Package-System Solution Center

Chip-Package-System Solution Center
by Paul McLellan on 08-14-2012 at 5:48 pm

One of the really big changes about chip design is the way over the last decade or so it is no longer possible to design an SoC, a package for it to go in and the board for the package using different sets of tools and methodologies and then finally bond out the chip and solder it onto the board. The three systems, Chip-Package-System have… Read More


Power Issues for Chip and Board: webinar

Power Issues for Chip and Board: webinar
by Paul McLellan on 03-10-2012 at 4:24 pm

Last month Brian Bailey at EDN moderated an interesting webinar about power issues. Unusually, it combined two different domains: doing things by modeling and actually taking measurements off real chips and boards. The two participants were Arvind Shanmugavel from the Apache subsidiary of Ansys, and Randy White from Tektronix.… Read More