There is a nice serendipity in discovering that two companies I cover are working together. Good for them naturally but makes my job easier because I already have a good idea about the benefits of the partnership. Synopsys and ANSYS announced a collaboration at DAC 2017 for accelerating design optimization for HPS, mobile and automotive.… Read More
Tag: bernard murphy
ANSYS at DAC
I’m not going to be at DAC this year because I scheduled a fishing trip at the end of June, assuming the show would stay true to form as an early/mid-June event. Still, having to endure salmon and halibut fishing in Alaska rather than slogging around Moscone Center, I can’t pretend to be too disappointed; I’ll be thinking of you all 😎.… Read More
The Wolper Method
If you read around topics in advanced formal verification you’re likely to run into something called Wolper coloring, or what Vigyan Singhal (Chief Oski at Oski) calls the Wolper method. Many domains have specialized techniques but what’s surprising in this instance is a seeming absence of helpful on-line explanations (though… Read More
The Starting Point of Functional Safety Analysis
In the course of building my understanding of functional safety, particularly with respect to ISO 26262, I have developed a better understanding of the design methods used to mitigate safety problems and the various tools and techniques that are applied to measure the impact of those diagnostics against ASIL goals. One area in… Read More
Foundry Partnership Simplifies Design for Reliability
This builds on a couple of topics I have covered for quite a while from an analysis point of view – integrity and reliability. The power distribution network and some other networks like clock trees are particularly susceptible to both IR-drop and electromigration (EM) problems. The first can lead to intermittent timing failures,… Read More
Thermal and Reliability in Automotive
Thermal considerations have always been a concern in electronic systems but to a large extent these could be relatively well partitioned from other concerns. Within a die you analyze for mean and peak temperatures and mitigate with package heat-sinks, options to de-rate the clock, or a variety of other methods. At the system level… Read More
When FPGA Design Looks More Like ASIC Design
I am sure there are many FPGA designers who are quite content to rely on hardware vendor tools to define, check, implement and burn their FPGAs, and who prefer to test in-system to validate functionality. But that approach is unlikely to work when you’re building on the big SoC platforms – Zynq, Arria and even the big non-SoC devices.… Read More
John Lee: Market Trends, Raising the Bar on Signoff
I talked to John Lee (GM of the ANSYS Semiconductor BU) recently about his views on market trends and the ANSYS big-picture theme for DAC 2018. He set the stage by saying he really liked Wally’s view on trends (see my blog on Wally’s keynote at U2U). John said these confirm what he is seeing – a trend to specialization, some around… Read More
SemiWiki and SmartDV on Verification IP
Bernard Murphy and I spent time with the SmartDV folks in preparation for the Design Automation Conference later this month. Bernard is an internationally recognized verification expert so his feedback is often sought after by emerging and leading verification companies, absolutely. Verification IP is a crowded market so … Read More
Single-Chip Narrow-Band IoT
Many factors go into building a competitive solution for the IoT, but few are as important for high-volume applications as low cost – not just chip cost but total system cost. If your customers are going to deploy thousands, tens of thousands or even millions of your devices in cities, factories, logistics applications, power grids… Read More