AMAT reports strong Q and even better guidance

AMAT reports strong Q and even better guidance
by Robert Maire on 08-21-2016 at 4:00 pm

Last quarter we said that AMAT got its mojo back and it appears to have even picked up speed going into the end of a strong year.

The display business which had been less than reliable in years past has come up with back to back home runs. Applied is growing both its top and bottom line at well above the sluggish market rates and is clearly… Read More


SEMICON West – Harry Levinson and Mike Lercel Interview

SEMICON West – Harry Levinson and Mike Lercel Interview
by Scotten Jones on 08-02-2016 at 12:00 pm

On Tuesday morning at SEMICON I had the opportunity to sit down with Harry Levinson, Sr. Director of Technology Research and Sr. Fellow at Global Foundries and Michael Lercel, Director of Strategic Marketing at ASML to discuss the state of lithography.

I opened the discussion with a question about how we are going to address lithography… Read More


ASML pays $3.1B for Hermes to get E-beam inspection

ASML pays $3.1B for Hermes to get E-beam inspection
by Robert Maire on 06-21-2016 at 7:00 am

Cheap versus year ago but expensive on fundementals – Net negative for KLAC/LRCX & AMAT. ASML bought Hermes Microvision for much the same reason as the Cymer acquisition – to support EUV. ASML could have made a counter offer for KLAC (as we had suggested previously) but this obviously would have been much more expensive… Read More


IMEC Technology Forum (ITF) – EUV When, Not If

IMEC Technology Forum (ITF) – EUV When, Not If
by Scotten Jones on 05-28-2016 at 7:00 am

For me personally EUV has been something of a roller coaster ride over the last several years. I started out a strong believer in EUV but then at the SPIE Advanced Lithography Conference in 2014 TSMC gave a very negative assessment of EUV, and there was a SEMATECH paper on high NA EUV that struck me as extremely unlikely to succeed. I … Read More


Intel EUV Photoresist Progress and ASML High NA EUV

Intel EUV Photoresist Progress and ASML High NA EUV
by Scotten Jones on 03-10-2016 at 4:00 pm

SPIE Days 3 and 4:

Anna Lio of Intel presented EUV resists: What’s next?

Intel wants to insert EUV at 7nm but it has to be ready and economical. Critical Dimension Uniformity (CDU), Line Width Roughness (LWR) and edge placement/stochastics are all stable on 22nm, 14nm and 10nm pilot lines.… Read More


Coventor ASML IMEC: The last half nanometer

Coventor ASML IMEC: The last half nanometer
by Scotten Jones on 01-19-2016 at 4:00 pm

On Tuesday evening December 8[SUP]th[/SUP] at IEDM, Coventor held a panel discussion entitled the “The last half nanometer”. Coventor is a leading provider of simulation software used to design processes. This is my third year attending the Coventor panel discussion at IEDM and they are always excellent with very strong panels… Read More


Moore’s Law and Silicon Forest

Moore’s Law and Silicon Forest
by Daniel Payne on 11-04-2015 at 4:00 pm

When I first moved to Oregon in 1978 the largest industry was forestry, but then the endangered Spotted Owl was found and that put an end to many forestry companies and decimated the economy of many rural cities. Strangely enough it turns out that the Spotted Owl was found in great numbers across multiple states, so it never should’ve… Read More