TSMC and Philips have deep historical ties. In fact, TSMC may not have existed without Philips. In the 1980s TSMC was established as a joint venture with Philips Electronics, the government of Taiwan, and other private investors. Several semiconductor companies were approached by Morris Chang for funding including semiconductor… Read More
Tag: asml
ASML Update SEMICON West 2023
At SEMICON West I had a chance to catch up with Mike Lercel of ASML. In this article I am going to combine ASML presentation material from the SPIE Advanced Lithography Conference, Mike’s SEMICON presentation, my discussions with Mike at SEMICON and a few items from ASML’s recent earnings call.
DUV
ASML continues to improve DUV systems.… Read More
ASML-Strong Results & Guide Prove China Concerns Overblown-Chips Slow to Recover
-ASML reports better results & guide despite China restrictions
-Supports our view of China issues not that impactful longer term
-Industry recovery seems very far off with more delays
-ASML remains the best, most robust story in a weak industry
ASML reports nice beat despite China concerns
ASML reported revenues of Euro6.9B… Read More
AMAT- Trailing Edge & China Almost Offset Floundering Foundry & Missing Memory
-AMAT reported inline resulted helped by trailing edge & China
-Memory remains at very low levels- Foundry remains uninspiring
-China seems to be buying anything they are allowed to buy
-The recovery is too far out & unknown to handicap
Quarter was OK and Guidance also OK
Revenue was $6.63B and EPS of $1.86 versus reduced… Read More
SPIE 2023 – imec Preparing for High-NA EUV
The SPIE Advanced Lithography Conference was held in February. I recently had the opportunity to interview Steven Scheer, vice president of advanced patterning process and materials at imec and review selected papers that imec presented.
I asked Steve what the overarching message was at SPIE this year, he said readiness for … Read More
Reality Checks for High-NA EUV for 1.x nm Nodes
The “1.xnm” node on most roadmaps to indicate a 16-18 nm metal line pitch [1]. The center-to-center spacing may be expected to be as low as 22-26 nm (sqrt(2) times line pitch). The EXE series of EUV (13.5 nm wavelength) lithography systems from ASML feature a 0.55 “High” NA (numerical aperture), targeted… Read More
LAM Not Yet at Bottom Memory Worsening Down 50%
-Lam reported in line results on reduced expectations
-Guidance disappoints as memory decline continues
-Memory capex down 50% but still sees “further declines”
-Lam ties future to EUV maybe not good idea after ASML report
Lam comes in above grossly already reduced expectations
and misses on guidance
We always … Read More
ASML Wavering- Supports our Concern of Second Leg Down for Semis- False Bottom
-ASML weakness is evidence of deeper chip down cycle
-When ASML sneezes other chip equip makers catch a cold
-Will backlog last long enough? Will EUV demand hold up?
-“Unthinkable” event, litho cancelations, could shock industry
ASML has in line quarter but alarm bells ring on wavering outlook
ASML reported Euro6.7B… Read More
Sino Semicap Sanction Screws Snugged- SVB- Aftermath more important than event
-Reports of further tightening of China SemiCap Restrictions
-Likely closing loopholes & pushing back technology line
-Dutch have joined, Japan will too- So far no Chinese reaction
-SVB is toast but repercussions may be far worse
Reports of tightening semiconductor sanctions on Friday
It was reported byBloomberg of Friday… Read More
Report from SPIE- EUV’s next 15 years- AMAT “Sculpta” braggadocio rollout
-We attended the SPIE lithography Conference in San Jose
-No significant news or announcements on EUV
-Focus on 500WPM target and High & Hyper NA rollout
-AMAT overblown Sculpta-Not exactly what its cracked up to be
SPIE Lithography 2023
We have been attending SPIE for many years now and are happy to see a return to pre Covid levels… Read More
