Understanding the electromagnetic (EM) coupling between various elements of a high-frequency semiconductor device is vital for meeting design specifications and ensuring reliable operation in the field. These EM interactions include not only the silicon chip but also extend to the package that encloses it. However, it may… Read More
Webinar: Ansys 2024 R1: Ansys Additive What’s New
Ansys Additive’s latest release enhances the 3D printing landscape by focusing on three key pillars: fidelity, usability, and optimization.
TIME:
FEBRUARY 14, 2024
11 AM EST / 5 PM CET / 9:30 PM IST
Venue:
Virtual
Overview
Fidelity provides users with advanced tools to control the 3D printing process precisely. With higher fidelity,