The Semicon Industry Keeps Wafer Fabs Moving Up

The Semicon Industry Keeps Wafer Fabs Moving Up
by Pawan Fangaria on 04-20-2016 at 7:00 am

The worldwide revenue of semiconductor industry has remained flat in last few years; to be more precise, overall semiconductor revenue declined by 1.9% in 2015 and Gartner forecasts it to further decline by 0.6% in 2016. The total revenue was at record high of $340.3 billion in 2014.

Well, semiconductor industry has matured. A … Read More


SEMICON Day 3: Leti, Intel Keynote, 450mm (Pic!) and Innovation Keynote

SEMICON Day 3: Leti, Intel Keynote, 450mm (Pic!) and Innovation Keynote
by Paul McLellan on 07-15-2015 at 11:59 am

Let’s start with yesterday evening, so technically yesterday. It was July 14th, which is the equivalent of Independence Day in France. So the perfect day for Leti, based in Grenoble, to present a lot of the work that they are doing on 3D “more than Moore” type technologies, including photonics. Also, wafer-scale… Read More


SEMICON West Preview

SEMICON West Preview
by Scotten Jones on 07-07-2015 at 7:00 am

Founded in 1971 (2015: 45th year), SEMICON West 2015 is coming to the Moscone Center in San Francisco on from Tuesday, July 14[SUP]th[/SUP] to Thursday, July 16[SUP]th[/SUP]. SEMICON is the premier show for equipment and materials companies supporting the semiconductor, MEMS and solar industries.

The main ways to get value … Read More


SEMICON Update: 450mm, EUV, FinFET, and More

SEMICON Update: 450mm, EUV, FinFET, and More
by Scotten Jones on 07-19-2014 at 3:00 pm

I spent all of last week at SEMICON West meeting with customers, potential customers, partners and various industry analysts and experts. I was involved in many interesting discussions over the course of the week and I thought I would share some of the more interesting observations:

Alternate Fin Materials Pushed Out
I have for… Read More


The State of 450mm Wafers. And Intel Gossip

The State of 450mm Wafers. And Intel Gossip
by Paul McLellan on 01-14-2014 at 11:55 pm

Paul Farrar, the General Manager of the Global 450mm Consortium (G450C) presented at the SEMI ISS conference today. What is G450C, it is a public-private consortium to develop a cost-effective 450mm wafer fabrication infrastructure, develop equipment prototypes and coordinate the industry move to 450mm. It is located in Albany… Read More


Technology Challenges: Intel, IBM, Xilinx, GlobalFoundries, IMEC

Technology Challenges: Intel, IBM, Xilinx, GlobalFoundries, IMEC
by Paul McLellan on 01-14-2014 at 7:00 pm

I spent the day at the SEMI Industry Strategy Symposium in Half Moon Bay. The early part of the day was devoted to technology challenges. Obviously everyone did not say exactly the same things, and had a little bit of a different spin depending on what business they are in. But there was a lot of commonality between Intel, IBM, Xilinx… Read More


TSMC: 3D, 450mm, CoWoS and More

TSMC: 3D, 450mm, CoWoS and More
by Paul McLellan on 12-18-2013 at 4:29 pm

The first keynote at the Burlingame 3D conference was by Doug Yu of TSMC. Not surprisingly he was talking about 3D. In particular, TSMC has WLSI technology that they call CoWoS, which stands for chip-on-wafer-on-substrate which pretty much describes how it is built. This is the technology that Xilinx uses for its recently announced… Read More


Intel Really is Delaying 14nm Move-in. 450mm is Slipping Too. EUV, who knows?

Intel Really is Delaying 14nm Move-in. 450mm is Slipping Too. EUV, who knows?
by Paul McLellan on 08-24-2013 at 3:23 pm

I attended the semi-annual SEMI Silicon Valley Lunch meeting last week. The semiconductor equipment people are the ones that really know what is going on. People can talk about capex numbers on conference calls but it is the equipment vendors who either do or do not get orders for particular types of equipment. In turn, the analysts… Read More


Want 10nm Wafers? That’ll Cost You

Want 10nm Wafers? That’ll Cost You
by Paul McLellan on 02-10-2013 at 9:01 pm

As you know, I’ve been a bit of a bear about what is happening to wafer costs at 20nm and below. At the Common Platform Technology Forum last week there were a number of people talking about this in presentations and at Harvey Jones’s “fireside chat”.

At the press lunch I asked about this. There are obviously… Read More


No EUV before 7nm?

No EUV before 7nm?
by Paul McLellan on 02-07-2013 at 1:31 pm

I was at the Common Platform Technology Forum this week. One of the most interesting sessions is IBM’s Gary Patton giving an overview of the state of semiconductor fabrication. Then, at lunchtime, he is one of the people that the press can question. In this post, I’m going to focus on Extreme Ultra-Violet (EUV) lithography.… Read More