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Highlights of the TSMC Technology Symposium 2021 – Silicon Technology

Highlights of the TSMC Technology Symposium 2021 – Silicon Technology
by Tom Dillinger on 06-13-2021 at 6:00 am

logic technology roadmap

Recently, TSMC held their annual Technology Symposium, providing an update on the silicon process technology and packaging roadmap.  This article will review the highlights of the silicon process developments and future release plans.

Subsequent articles will describe the packaging offerings and delve into technology … Read More


TSMC and the FinFET Era!

TSMC and the FinFET Era!
by Daniel Nenni on 06-09-2021 at 6:00 am

Intel 22nm wafer

While there is a lot of excitement around the semiconductor shortage narrative and the fabs all being full, both 200mm and 300mm, there is one big plot hole and that is the FinFET era.

Intel ushered in the FinFET era only to lose FinFET dominance to the foundries shortly thereafter. In 2009 Intel brought out a 22nm FinFET wafer at the… Read More


TSMC 2021 Technical Symposium Actions Speak Louder Than Words

TSMC 2021 Technical Symposium Actions Speak Louder Than Words
by Daniel Nenni on 06-01-2021 at 1:00 pm

TSMC Symposium 2021

The TSMC Symposium kicked of today. I will share my general thoughts while Tom Dillinger will do deep dives on the technology side. The event started with a keynote by TSMC CEO CC Wei followed by technology presentations by the TSMC executive staff.

C.C. Wei introduced a new sound bite this year that really resonated with me and that… Read More


Enabling Silicon Technologies to Address Automotive Radar Trends and Requirements

Enabling Silicon Technologies to Address Automotive Radar Trends and Requirements
by Kalar Rajendiran on 06-01-2021 at 6:00 am

Current GF Nodes Supporting Automotive

During the week of April 19th, Linley held its Spring Processor Conference 2021. The Linley Group has a reputation for putting on excellent conferences. And this year’s spring conference was no exception. There were a number of very informative talks from various companies updating the audience on the latest research and development… Read More


Machine Learning Applied to Increase Fab Yield

Machine Learning Applied to Increase Fab Yield
by Tom Dillinger on 05-25-2021 at 8:00 am

enhanced defect images

Machine learning applications have become pervasive and increasingly complex, from recommendation agents in online interactions to personal assistants for command response to (ultimately) autonomous vehicle control.  Yet, an often overlooked facet of machine learning technology is the deployment in industrial process… Read More


Extending Moore’s Law with 3D Heterogeneous Materials Integration

Extending Moore’s Law with 3D Heterogeneous Materials Integration
by Tom Dillinger on 05-18-2021 at 10:00 am

nFET Si pFET Ge

A great deal has been written of late about the demise of Moore’s Law.  The increase in field-effect transistor density with successive process nodes has slowed from the 2X every 2 1/2 years pace of earlier generations.  The economic nature of Moore’s comments 50 years ago has also been scrutinized – the reduction in cost per transistorRead More


Is IBM’s 2nm Announcement Actually a 2nm Node?

Is IBM’s 2nm Announcement Actually a 2nm Node?
by Scotten Jones on 05-09-2021 at 6:00 am

Slide1

IBM has announced the development of a 2nm process.

IBM Announcement

What was announced:

  • “2nm”
  • 50 billion transistors in a “thumbnail” sized area later disclosed to be 150mm2 = 333 million transistors per millimeter (MTx/mm2).
  • 44nm Contacted Poly Pitch (CPP) with 12nm gate length.
  • Gate All Around (GAA), there are several ways
Read More

You know you have a problem when 60 Minutes covers it!

You know you have a problem when 60 Minutes covers it!
by Robert Maire on 05-03-2021 at 2:00 pm

60 Minutes Chip Shortage

-Chip shortage on 60 Minutes- Average Joe now aware of chip issue
-Intel sprinkling fairy dust (money) on New Mexico & Israel
-Give up on buy backs and dividends
-Could Uncle Sam give a handout to Intel?

You normally don’t want to answer the door if 60 Minutes TV crew is outside as it likely doesn’t mean good things.… Read More


Intel’s EMIB Packaging Technology – A Deep Dive

Intel’s EMIB Packaging Technology – A Deep Dive
by Tom Dillinger on 05-03-2021 at 6:00 am

EMIB configurations

The evolution of low-cost heterogeneous multi-chip packaging (MCP) has led to significant system-level product innovations.  Three classes of MCP offerings have emerged:

  • wafer-level fan-out redistribution, using reconstituted wafer substrates of molding compound as the surface for interconnections between die (2D)
Read More

How to Spend $100 Billion Dollars in Three Years

How to Spend $100 Billion Dollars in Three Years
by Scotten Jones on 04-25-2021 at 6:00 am

Slide1 1

TSMC recently announced plans to spend $100 billion dollars over three years on capital. For 2021 they announced $30B in total capital with 80% on advanced nodes (7nm and smaller), 10% on packaging and masks and 10% on “specialty”.

If we take a guess at the capital for each year, we can project something like $30B for 2021 (announced),… Read More