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For a small company, Solido has some very large customers and partners, TSMC being on of them. Why? Because of the high yield and memory performance demand on leading edge technologies, that’s why.
Much has been made of and will continue to be said on the march of Moore’s Law. While economics of scale and performance vs. power… Read More
Tuesday morning at DAC I attended the Synopsys-hosted breakfast to hear from foundries and ARM about the challenges of designing and delivering silicon at the 32nm/28nm and 20nm nodes.
… Read More
Ciranova presented a hierarchical custom layout flow used on several large advanced-node designs to reduce total layout time by about 50%. Ciranova itself does automated floorplanning and placement software with only limited routing; but since the first two constitute the majority of custom layout time, and strongly influence… Read More
Black Swan Events are not to be embraced, they are to be feared, if conventional wisdom holds true. And yet, the 2011 Black Swan that slammed the PC market (i.e. the Thailand Floods that wiped out a large part of the disk drive market) has turned out to be the key catalyst for reshaping the semiconductor industry in 2012 and 2013. Instead… Read More
Atrenta presented an update on the TSMC Soft IP Alliance Program at TSMC’s theater each day at DAC. Mike Gianfagna, Atrenta VP of Marketing, presented an introduction to SpyGlass, an overview of the program and a progress report. Dan Kochpatcharin, TSMC Deputy Director of IP Portfolio, was also there. Between Mike, Dan, and I there… Read More
I caught the Berkeley Design Automation presentation in the TSMC Theater, where Simon Young (BDA’s director of product marketing) described the Analog FastSPICE (AFS) nanometer circuit verification platform, built on their foundation of very fast, very accurate, high capacity circuit simulation.
BDA claims the AFS platform… Read More
What a great interview! Xilinx CEO Moshe Gavrielov is right on the money HERE where he credits the high 28nm yields to the “very intimate” linkage in process development with TSMC.… Read More
Wednesday morning I attended a panel discussion with: ARM, IBM, Cadence, GLOBALFOUNDRIES and Samsung.
The panelists all sang the same song of collaboration between EDA, IP and Foundry to enable 28nm, 20nm and even 14nm.… Read More
On Wednesday there is a User Track Poster Session that examines the design impact of process variation in GLOBALFOUNDRIES 28nm technology. For those of you who are wondering what process variation looks like at 20nm take this 28nm example and multiply it by one hundred (slight exaggeration, maybe).
Variation effects have a significant… Read More
Ever since the “Intel Reinvents Transistors Using New 3-D Structure” PR campaign I have been at odds with them. As technologists, I have nothing but respect for Intel. The Intel PR department, however, quite frankly, is evil. Correct me if I’m wrong here but Intel did not “reinvent” the transistor. Nor did they come up with the name… Read More
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SoC PLANNER: A New Generation of SoC Design Exploration Solution Managing Cost-effectiveness and Sustainability