From my viewpoint, standards organizations in semiconductor design always looked like they were “sharpening the saw”: further polishing/refining what we already have but not often pushing on frontiers. Very necessary of course to stabilize and get common agreement in standards but equally always seeming to be behind the innovation… Read More
Analog Bits Demos Real-Time On-Chip Power Sensing and Delivery on N2P at the TSMC 2026 Technology SymposiumAnalog Bits has a way of stealing the…Read More
Disaggregating LLM Inference: Inside the SambaNova Intel Heterogeneous Compute BlueprintSambaNova Systems and Intel have introduced a blueprint…Read More
CEO Interview with Johan Wadenholt Vrethem of VoxoWith over two decades of experience bridging technology…Read More
TSMC to Elon Musk: There are no Shortcuts in Building Fabs!The opening of the TSMC 2026 earning call…Read More
Speculation: Silicon’s Most Expensive CompulsionHow Time-Based Scheduling Reclaims Silicon Wasted by Speculative…Read MoreElectrical Rule Checking in PCB Tools
I’ve known about DRC (Design Rule Checking) for IC design, and the same approach can also be applied to PCB design. The continuous evolution of electronics has led to increasingly intricate PCB designs that require Electrical Rule Checking (ERC) to ensure that performance goals are met. This complexity poses several challenges… Read More
Synopsys Brings Multi-Die Integration Closer with its 3DIO IP Solution and 3DIC Tools
There is ample evidence that technologies such as high-performance computing, next-generation servers, and AI accelerators are fueling unprecedented demands in data processing speed with massive data storage, lower latency, and lower power. Heterogeneous system integration, more commonly called 2.5 and 3D IC design, … Read More
What is Wrong with Intel?
One of the most popular topics on the SemiWiki forum is Intel, which I understand. Many of us grew up with Intel, some of us have worked there, and I can say that the vast majority of us want Intel to succeed. The latest Intel PR debacle is the abrupt departure of CEO Pat Gelsinger. To me this confirms the answer to the question, “What is … Read More
Enhancing System Reliability with Digital Twins and Silicon Lifecycle Management (SLM)
As industries become more reliant on advanced technologies, the importance of ensuring the reliability and longevity of critical systems grows. Failures in components, whether in autonomous vehicles, high performance computing (HPC), healthcare devices, or industrial automation, can have far-reaching consequences.… Read More
Podcast EP265: The History of Moore’s Law and What Lies Ahead with Intel’s Mr. Transistor
Dan is joined by Dr. Tahir Ghani, Intel senior fellow and director of process pathfinding in Intel’s Technology Research Group. Tahir has a 30-year career at Intel working on many innovations, including strained silicon, high-K metal gate devices, FinFETs, RibbonFETs, and backside power delivery (BSPD), among others. He has… Read More
Podcast EP264: How Sigasi is Helping to Advance Semiconductor Design with Dieter Therssen
Dan is joined by Dieter Therssen, CEO of Sigasi. Deiter started his career as a hardware design engineer, using IMEC’s visionary tools and design methodologies in the early days of silicon integration. Today, being CEO of Sigasi, a fast-growing, creative technology company is a perfect fit for Dieter. Having worked in that space… Read More
CEO Interview: GP Singh from Ambient Scientific
Gajendra Prasad Singh, also known as GP Singh, is a seasoned tech professional with over 26 years of experience in advanced semiconductor chips. With a zeal to solve the most complex technical problems, he harped on a difficult journey to create programmable AI Microprocessors, that provide high-performance in a cost-effective… Read More
SystemReady Certified: Ensuring Effortless Out-of-the-Box Arm Processor Deployments
When contemplating the Lego-like hardware and software structure of a leading system-on-chip (SoC) design, a mathematically inclined mind might marvel at the tantalizing array of combinatorial possibilities among its hardware and software components. In contrast, the engineering team tasked with its validation may have… Read More
PDF Solutions Hosts Executive Conference December 12 on AI’s Power to Transform Semiconductor Design and Manufacturing
PDF Solutions, Inc. will host an AI Executive Conference Thursday, December 12, in San Francisco featuring keynotes, presentations, panels and demonstrations offering insights into the power of AI to transform semiconductor design and manufacturing. The conference immediately follows the 70th Annual IEEE International… Read More


Is Intel About to Take Flight?