The Yield Partnership: Intel and PDF Solutions Tackle Advanced NodesOne of the most difficult things to do…Read More
Webinar: Faster Design Spec to Implementation using IP-XACTAs SoC design flows grow increasingly complex, IP-XACT…Read More
Webinar: Caspia Shows You How to Fix Security Flaws Before It’s Too LateI recently posted an overview of an upcoming…Read More
Feed Forward Intelligence: Enabling Testability in the Chiplets EraThe semiconductor industry is entering a new era…Read More
Synopsys Unifies Electrical, Thermal, Mechanical, and Optical Analysis with Multiphysics Fusion Solutions Market Leaders Including Cisco,…Read More
Vince Hu of Altera presented us her at the GlobalPress Electronics Summit on their process roadmap. Since just a month or two ago they announced that Intel would be their foundry at 14nm, everyone wanted to get a better idea of what was really going on.
At 28nm, Altera use 2 processes, TSMC 28HP (for high end Stratix-5 devices) and TSMC… Read More
Most simple testbenches have close to no structure, are terrible to modify and hopeless to understand. They often take far too much time to implement and provide close to no support when debugging potential problems. This webinar will demonstrate how to build a far better testbench with respect to all these issues – in significantly… Read More
We’ve blogged before about Layout Dependent Effects (LDE) on SemiWiki and how it further complicates the IC design and layout process, especially at 28nm and lower nodes because the IC layout starts to change the MOS device performance. There’s an interesting webinarfrom Cadence on Variation-aware IC Design, … Read More
“Now, here, you see, it takes all the running you can do, to keep in the same place. If you want to get somewhere else, you must run at least twice as fast as that!”
—Lewis Carroll, Through the Looking Glass
The use of stitching can greatly reduce the number of double patterning (DP) decomposition violations that a designer has to resolve.… Read More
Foundries and EDA vendors are cooperating at increasing levels of technical intimacy as we head to the 20nm and lower nodes. Cadence has a strong position in the EDA tools used for IC design and layout of custom and AMS (Analog Mixed-Signal) designs. They have created a series of webinars to highlight the design challenges and new… Read More
The news this week that PC sales dropped by double digit percentages and to a level not seen since 2006 sent shudders down the halls of OEMs and chip suppliers. Are we entering a final death spiral as opposed to the gradual decline that most expected? Perhaps there is another explanation. From a distance, it appears that the mobile … Read More
On Friday (April 19[SUP]th[/SUP]) I will be keynoting FinFET day at the EDPS conference in Monterey. This is an excellent opportunity to ask the experts about the challenges of FinFET design and manufacturing in an intimate setting (60 people). If you are interested register today and use the promo codeSemiWiki-EDPS-JFR and … Read More
Ivo Bolsens, the CTO of Xilinx, is giving the opening keynote at the Electronic Design Process Symposium (EDPS) in Monterey on Thursday and Friday this coming week. The title of his keynote is The All Programmable SoC – At the Heart of Next Generation Embedded Systems. He covers a lot of ground but the core of his presentation… Read More
For the last few years, thru silicon via (TSV) based ICs have been looming in the mist of the future. Just how far ahead are they? Xiliinx famously has a high-end gate-array in production on a 2.5D interposer, Micron has a memory cube, TSMC has done various things in 3D that it calls CoWoS (chip on wafer on substrate), Qualcomm have been… Read More
This was the 19[SUP]th[/SUP] annual TSMC Symposium and by far the best I have attended. Finally tired of the misinformation that plagues our industry, TSMC set the record straight with wafer and silicon correlated data. TSMC shipped more than 88 MILLION logic wafers in 2012, more than any other semiconductor company, that gives… Read More
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Intel 18A vs Intel 18A-P: What Is the Difference and Why Does It Matter?