Semiwiki 400x100 1 final

CEVA-XC4000 new DSP IP core

CEVA-XC4000 new DSP IP core
by Eric Esteve on 07-19-2012 at 9:53 am

The CEVA-XC4000 offers unparalleled, scalable performance capabilities and innovative power management to address the most demanding communication standards, including LTE-Advanced, 802.11ac and DVB-T2, on a single architecture. Building upon its highly successful predecessors, the CEVA-XC4000 architecture sets… Read More


TSMC Reports Second Highest Quarterly Profit!

TSMC Reports Second Highest Quarterly Profit!
by Daniel Nenni on 07-19-2012 at 5:23 am

We all knew this quarter would be big but maybe not this big. Not all good news though so keep on reading. The news coverage is all over the map, mostly because they have no idea what a pure-play foundry really is. They also underestimate the power of mobile computing which should be a “Revenue by Application” market segment itself. … Read More


Higgs bosons, (un)certainty, and black holes

Higgs bosons, (un)certainty, and black holes
by Beth Martin on 07-18-2012 at 9:00 pm

Ever since the announcement in early July from CERN that they likely have, probably, finally found the Higgs boson, I’ve been thinking about what quantum mechanics means to our daily ‘classical model’ existence. On the surface, nothing. The most fantastical aspects of quantum mechanics, like uncertainty, tunneling and the … Read More


It Takes a Village: Mentor and ARM Team Up on Test

It Takes a Village: Mentor and ARM Team Up on Test
by Beth Martin on 07-18-2012 at 5:01 pm

Benjamin Franklin, “I didn’t fail the test, I just found 100 ways to do it wrong.” I was reminded of this line during a joint Mentor-ARM seminar yesterday about testing ARM cores and memories. The complexity of testing modern SoC designs at advanced nodes, with multiple integrated ARM cores and other IP, opens up plenty of room for… Read More


How Do You Extract 3D IC Structures?

How Do You Extract 3D IC Structures?
by Daniel Payne on 07-18-2012 at 2:01 pm

The press has been buzzing about 3D everything for the past few years, so when it comes to IC design it’s a fair question to ask how would you actually extract 3D IC structures for use by analysis tools like a circuit simulator. I read a white paper by Christen Decoin and Vassilis Kourkoulos of Mentor Graphics this week and became… Read More


EDAC Announces EDA up 6.3% in Q1 versus 2011

EDAC Announces EDA up 6.3% in Q1 versus 2011
by Paul McLellan on 07-17-2012 at 11:24 pm

EDAC announced that EDA industry revenue increased 6.3% for Q1 2012 to $1536.9M compared to a year ago. Sequentially it declined, as it normally does from Q4 to Q1, by 9.6%. Every category except services increased revenue and every region increased revenue except for Japan. The full report is available by subscription, of course.… Read More


EUV Masks

EUV Masks
by Paul McLellan on 07-17-2012 at 11:00 pm

This is really the second part to this blog about the challenges of EUV lithography. The next speaker was Franklin Kalk who is CTO of Toppan Photomasks. He too emphasized that we can make almost arbitrarily small features but more and more masks are required (not, that I suspect, he would complain being in the mask business). For EUV… Read More


Design-to-Silicon Platform Workshops!

Design-to-Silicon Platform Workshops!
by Daniel Nenni on 07-17-2012 at 7:30 pm

Have you seen the latest design rule manuals? At 28nm and 20nm design sign-off is no longer just DRC and LVS. These basic components of physical verification are being augmented by an expansive set of yield analysis and critical feature identification capabilities, as well as layout enhancements, printability, and performance… Read More


3D Thermal Analysis

3D Thermal Analysis
by Paul McLellan on 07-17-2012 at 11:32 am

Matt Elmore of ANSYS/Apache has an interesting blog posting about thermal analysis in 3D integrated circuits. With both technical and economic challenges at process nodes as we push below 28nm, increasingly product groups are looking towards through-silicon-via (TSV) based approaches as a way of keeping Moore’s law… Read More


An Approach to 20nm IC Design

An Approach to 20nm IC Design
by Daniel Payne on 07-17-2012 at 10:10 am

Last month at DAC I learned how IBM, Cadence, ARM, GLOBALFOUNDRIES and Samsung approach the challenges of SoC design, EDA design and fabrication at the 20nm node. Today I followed up by reading a white paper on 20nm IC design challenges authored by Cadence, a welcome relief to the previous marketing mantra of EDA 360.

Here’s… Read More