Siemens EDA Expands AI and Advanced Packaging Collaboration with TSMCAt the recent TSMC Technology Symposium 2026, Siemens…Read More
PQShield unveils ultra-small PQC embedded security breakthroughs at Embedded World 2026As the threat of quantum computing to modern…Read More
Closing the Silicon Realization Gap: From Static DFM to Governance for Lifecycle (GFL)The semiconductor industry has achieved extraordinary mastery in…Read More
imec IC-Link and TSMC 3DFabric Alliance Expansion Signals New Era of System-Level Scalingimec announced that IC-Link by imec has joined…Read More
IC designers use EDA tools to implement their logical and physical design, and these tools require foundry-specific information for:
I’ve been blogging about EDA and Semiconductor companies using social media to create new ways to talk and listen to engineers, so today I looked at Aldec and how they are using social media. Aldec offers EDA products for: FPGA Simulation, functional verification, emulation, and MIL/Aero verification. Their Home page … Read More
Did you go to IEDM 2013 in Washington DC ? You may have attended to the “Advanced CMOS Technology Platform” chaired by TSMC, and listen to the FD-SOI related presentation “High Performance UTBB FDSOI Devices Featuring 20nm Gate Length for 14nm Node and Beyond”. According with the abstract, this paper is the first time report of “high… Read More
Wednesday, January 8.
Sensors are big at CES. Big as in many vendors and applications, but small in size. Sensors were prominent features in automobiles, PCs, tablets and mobile phones. But the most exciting is the relatively new area of digital health and fitness. CES has 366 exhibitors in this category, with most of them featuring… Read More
Taking place annually in Silicon Valley, DesignCon is the premier educational conference and technology exhibition for electronic design engineers in the high speed communications and semiconductor communities.
Created by engineers for engineers, DesignCon is the largest gathering of chip, board and systems designers… Read More
When people discuss capabilities of leading edge process nodes they tend to focus on digital logic. Microprocessors in particular. But a process requires more than just digital logic and standard cells to be successful. In particular, pretty much every SoC contains a lot of memory so the memory capabilities of a process are important.… Read More
Tuesday, January 7
Today was the official start of International CES. The crowds were huge – almost every area of the massive Las Vegas Convention Center was crowded.
Now that we have all spent lots of money replacing our old picture tube television sets with big flat panel HDTVs, manufacturers are pushing the next big thing: Ultra… Read More
Gone are the days when analog design had its sweet space on a single chip. However, it’s the main driver in this new electronic world which is geared by Internet-of-Things, wireless, mobile, remote control and so on. How does an electronic device sense a touch by human, motion, temperature, sound etc.? It’s the analog circuitry … Read More
Monday, January 6, 2014.Press conference day at International CES, starting with LG at 8 am and finishing with Sony at 5 pm. Some of the most interesting presentations (I will not overuse the word “cool” today) were:
Izon, LLC introduced a glasses-free 3D TV. They demonstrated on a 24 inch screen playing the latest … Read More
I like to call Andes Technology the biggest microprocessor IP company you’ve never heard of. I wrote about themback in October when I sat down with them during the Linley Microprocessor Conference. Part of the reason you have never heard of them is that they are based in Taiwan and most of their business is in Taiwan and China.… Read More
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ASML High-NA EUV is Not Ready for High-Volume Production