70% of today’s ASIC and SoC designs are being prototyped on FPGAs. Everybody knows that. But, did you know that automating the process of converting what could be thousands of ASIC “golden” files into FPGA-friendly versions can mean big savings in a large design?… Read More




How to Quickly Optimize BEOL Process at Your Desk?
Engineers are always looking to improve the efficiency of how they work, but don’t want to sacrifice accuracy in the process. This is true in the world of semiconductor process development, where traditional build-and-test cycles are both time and resource intensive. But what if there was a way to do certain steps in a ‘virtual’… Read More
Another Negative Year for Semiconductor CapEx
Global semiconductor capital spending is headed for another decline in 2013, following a 12% decline in 2012. Gartner’s September forecast called for a 7% decline in 2013. Most of the major spenders expect flat to declining expenditures in 2013. Intel in July estimated 2013 spending of $11 billion, flat with 2012 and down from … Read More
With SCE-MI, timing really is everything
In one of my favorite movies, Brad Pitt utters the only question that matters in baseball or technology management in the face of uncertainty: “Okay, good. What’s the problem?” Not surprisingly in that scene, as the question circles the table of experts used to doing things the old way, not a single one can answer it correctly in the… Read More
TSMC Open Innovation Platform Forum, October 1st
One of TSMC’s two big Silicon Valley events each year is the Open Innovation Platform (OIP) Forum. This year it is on Tuesday October 1st. It is in the San Jose Convention Center and starts at 9am (registration opens at 8am). Pre-registration to attend is now open here or click on the image to the right.
From 9.10 to 9.40 is the … Read More
What Mentor Said at ITC
At the ITC test conference in early September, Mentor made three announcements. ITC is a big event for Mentor’s test group, and where they usually roll out their new tools and capabilities. The indefatigable Steve Pateras was captured on film describing them.
I’ve summarize Mentor’s three announcements and added… Read More
The US Executive Forum 2013
The US Executive Forum hosted by the Global Semiconductor Alliance was held last night at the beautiful Rosewood Sand Hill Hotel in Menlo Park. We all have memorable events in our professional lives and this is one of mine, absolutely. The audience was filled with semiconductor executives from around the world who chatted freely… Read More
Dan Niles: Tapering and the Global Economy
Yesterday was Dan Niles quarterly review that he does for GSA. As always he starts from the big picture of the world economy and works his way to a semiconductor forecast. The focus of this quarter was whether the world economy is strong enough for the US to “taper” and reduce the amount of quantitative easing (aka flooding… Read More
Hybrid Memory Cube Shipping
Today Micron announced that it is shipping 2GB Hybrid Memory Cube (HMC) samples. The HMC is actually 5 stacked die connected with through-silicon-vias (TSVs). The bottom die is a logic chip and is actually manufactured for Micron in an IBM 32nm process (and doesn’t have any TSVs). The other 4 die are 4Gb DRAM die manufactured… Read More
Intel 14nm versus Samsung 14nm
The legend of Intel being two process nodes ahead of the rest of the industry is quickly coming to an end. To come to terms with this you need to do an apple to apple comparison which is what I will do right here, right now.
First and foremost let’s compare SoC silicon delivery since SoCs are driving the semiconductor industry and will … Read More
Flynn Was Right: How a 2003 Warning Foretold Today’s Architectural Pivot