The 8051 processor has been widely used in many embedded applications over the past 30 years. While the 8051 core is small and simple-to-use, the newest generation of consumer electronics being developed today often require more than the 8051 MCU can reasonably deliver. New SOC applications such as flash drives, power management… Read More




Sidense Beats Kilopass in Court Again!
The technology headlines in 2013 were often stolen by frivolous legal actions that made little or no sense to me at all. Patent Trolling is at an all-time high inside the fabless semiconductor ecosystem and as a result litigation reform is coming to Silicon Valley, believe it.
Currently working its way through the legislative process… Read More
Curved touchscreens
CES 2014 was the modern technology equivalent of the voyage of Ferdinand Magellan, proving beyond any shadow of doubt displays no longer can be thought of as only flat. While the massive curved 105-inch TVs shown by LG and Samsung drew many gawkers, the implications of curved touch displays are even wider.… Read More
An Update on the OpenPDK for IC Design
IC designers use EDA tools to implement their logical and physical design, and these tools require foundry-specific information for:
- Design Rule Checking (DRC)
- Layout Versus Schematic (LVS)
- Library Symbols
- Parasitic EXtraction (PEX)
Social Media at Aldec
I’ve been blogging about EDA and Semiconductor companies using social media to create new ways to talk and listen to engineers, so today I looked at Aldec and how they are using social media. Aldec offers EDA products for: FPGA Simulation, functional verification, emulation, and MIL/Aero verification. Their Home page … Read More
UTBB FDSOI Devices Featuring 20nm Gate Length
Did you go to IEDM 2013 in Washington DC ? You may have attended to the “Advanced CMOS Technology Platform” chaired by TSMC, and listen to the FD-SOI related presentation “High Performance UTBB FDSOI Devices Featuring 20nm Gate Length for 14nm Node and Beyond”. According with the abstract, this paper is the first time report of “high… Read More
International CES: Day Four
Wednesday, January 8.
Sensors are big at CES. Big as in many vendors and applications, but small in size. Sensors were prominent features in automobiles, PCs, tablets and mobile phones. But the most exciting is the relatively new area of digital health and fitness. CES has 366 exhibitors in this category, with most of them featuring… Read More
Low Power @ DesignCon 2014
Taking place annually in Silicon Valley, DesignCon is the premier educational conference and technology exhibition for electronic design engineers in the high speed communications and semiconductor communities.
Created by engineers for engineers, DesignCon is the largest gathering of chip, board and systems designers… Read More
FD-SOI Memories
When people discuss capabilities of leading edge process nodes they tend to focus on digital logic. Microprocessors in particular. But a process requires more than just digital logic and standard cells to be successful. In particular, pretty much every SoC contains a lot of memory so the memory capabilities of a process are important.… Read More
International CES: Day Three
Tuesday, January 7
Today was the official start of International CES. The crowds were huge – almost every area of the massive Las Vegas Convention Center was crowded.
Now that we have all spent lots of money replacing our old picture tube television sets with big flat panel HDTVs, manufacturers are pushing the next big thing: Ultra… Read More
Memory Innovation at the Edge: Power Efficiency Meets Green Manufacturing