Microsoft BUILD is the company’s annual developer conference where they communicate their latest strategies and deliverables to developers and launch many new innovations. BUILD is extremely developer- focused and is intended to inform current Microsoft developers as well as recruit more developers to develop for Microsoft… Read More
DAC News – proteanTecs Unlocks AI Hardware Growth with Runtime MonitoringAs AI models grow exponentially, the infrastructure supporting…Read More
Sophisticated soundscapes usher in cache-coherent multicore DSPDigital audio processing is evolving into an art…Read More
A Quick Look at Agentic/Generative AI in Software EngineeringAgentic methods are hot right now since single…Read More
Improve Precision of Parasitic Extraction for Digital DesignsBy Mark Tawfik Parasitic extraction is essential in…Read More
How AT&T Will Turn on Car 2 Car Connectivity
Cnet reports that, starting this week, AT&T is offering “Unlimited Plan” customers the option to add connected cars or a ZTE Mobley Wi-Fi plug-in device to their plan for $40/month for unlimited data – $10/month will buy 1GB. The plan applies to certain Buick, Audi, Chevrolet, Cadillac, GMC, Jaguar, Land… Read More
Banks and Retailers need to win in IOT
In the runtime for the current mobile ecosystem – apps:
- Average user has 21 apps on her smart phone, out of the total 1.5m apps on app-store
- While apps account for more than half the time user spends on digital/smart platform, an average user spend more than 40% of that time on a single app
- 2/3rd of all smartphone user did not download
ARM tests out TSMC 10FinFET – with two cores
About 13 months ago, the leak blogs posted news of “Artemis” on an alleged ARM roadmap slide, supposedly a new 16FF ARM core positioned as the presumptive successor to the Cortex-A57. Now, we’re finding out what “Artemis” may actually be, inside a multi-core PPA test chip on TSMC 10FinFET.… Read More
Who protects power protection chips?
Power protection chips are widely used these days to protect sensitive circuitry from over-voltage and over-current stress. However, these workhorse chips are often subjected to extraordinary thermal stress themselves and need to be protected from burning up – literally.
Power protection chips work like electronic fuses,… Read More
IMEC Technology Forum (ITF) – IC Innovation
IMEC is a technology research center located in Belgium that is one of the premier semiconductor research centers in the world today. The IMEC Technology Forum (ITF) is a two-day event attended by approximately 1,000 people to showcase the work done by IMEC and their partners.
Luc Van Den Hove is the president and CEO of IMEC and he… Read More
TSMC Leads Again with 3-D Packaging!
Continuing to find new ways to extend Moore’s Law, the foundry and technology leader is ready to show off its wafer level system integration prowess with two scalable platforms targeting key growth markets.
CoWoS® (Chip-On-Wafer-On-Substrate) goes after high-performance applications, providing the highest bandwidth and… Read More
Autotalks’ New V2X Processor Integrates CEVA-XC DSP to Support IEEE802.11p and WiFi
V2X stands for Vehicle to Everything and to be specific, V2X technology connects vehicles to other vehicles (V2V), infrastructure (V2I), motorcycles (V2M) and pedestrians (V2P) within wireless range for safety and mobility applications. If you consider that the US Department of transportation (USDOT) is expected to publish… Read More
5G, Video and SDNs – High Volume Drivers for Photonic Systems-on-Chip (PSoC)
The move towards 5G networks with demands for decreased latency ( 100 devices/m[SUP]2[/SUP]), and the desire to flexibly configure and integrate mobile, fixed, optical and satellite telecommunications is putting tremendous pressure on the design of next generation telecom equipment. Silicon photonics promises to be the… Read More
5G, Video and SDNs – High Volume Drivers for Photonic Systems-on-Chip (PSoC)
The move towards 5G networks with demands for decreased latency ( 100 devices/m[SUP]2[/SUP]), and the desire to flexibly configure and integrate mobile, fixed, optical and satellite telecommunications is putting tremendous pressure on the design of next generation telecom equipment. Silicon photonics promises to be the… Read More
Memory Innovation at the Edge: Power Efficiency Meets Green Manufacturing