In the previous blog, Cybercriminals Next Targets: Short Term Dangers (part 1 of 2), I outlined how cybercriminals will use the holiday season to victimize unwary consumers and target businesses. They will also dive deeper into leveraging Internet-of-Things (IoT) devices. The longer-term outlook expands their reach to more… Read More
Revolutionizing Hardware Design Debugging with Time Travel TechnologyIn the semiconductor industry High-Level Synthesis (HLS) and…Read More
Addressing Silent Data Corruption (SDC) with In-System Embedded Deterministic TestingSilent Data Corruption (SDC) represents a critical challenge…Read More
TSMC's 6th ESG AWARD Receives over 5,800 Proposals, Igniting Sustainability PassionTaiwan Semiconductor Manufacturing Company has once again demonstrated…Read More
Tiling Support in SiFive's AI/ML Software Stack for RISC-V Vector-Matrix ExtensionAt the 2025 RISC-V Summit North America, Min…Read More
TSMC based 3D Chips: Socionext Achieves Two Successful Tape-Outs in Just Seven Months!Socionext’s recent run of rapid 3D-IC tape-outs is…Read MoreGLOBALFOUNDRIES ASIC Update!
Back in my IP days we spent a lot of time with the ASIC companies chasing multi-million dollar licensing deals. IBM was a fierce ASIC competitor back then with leading edge processes and a silicon proven IP catalog that was unmatched.
Unfortunately that ended at 65nm as the pure-play foundries (TSMC and UMC) and fabless ASIC companies… Read More
Waymo Misses the Boat… Wayless?
The big news in the world of transportation today is Alphabet’s spinoff of its automated driving business into a business unit called Waymo. The effort is positioned as Alphabet’s formal attempt to commercialize automated driving technology.
The project has been greeted with much fanfare and rumors of a late 2017… Read More
Cybercriminals Next Targets: Short Term Dangers (part 1 of 2)
Knowing what cybercriminals are targeting today is easy. Their attacks are loud, impactful, and have the elegance of a herd of bulls crashing through a glassware shop. The tougher challenge is figuring out where they will take aim tomorrow. Knowing where cyber threats will attack in the future, gives the necessary insights to … Read More
An End of Year View of Semi Consolidation
The last couple of years have been tumultuous for the semiconductor market. IC Insights just released a report showing just how much consolidation has concentrated market strength in a small number of companies. The report (which excludes fabs) shows that the 5 top companies – Intel, Samsung, Qualcomm, Broadcom and SK Hynix – … Read More
Advanced Semiconductor Process Cost Trends
The cost trend for leading edge semiconductor technologies is a subject of some controversy in the industry. Cost is a complex issue with many interacting factors and much of the information out in the industry is in my opinion misleading or incorrect. In this article, I will discuss each of the factors as well as present a view of … Read More
#CES2017: Aftermarket to the Rescue
Has it really been 50 years? Listening to a George Hotz Udacity podcast got me to thinking that the upcoming CES 2017 in Las Vegas will be a turning point in automated driving technology. It was just two years ago that Audi was self-driving itself from California to Nevada for CES 2015, but we don’t seem to have come that far in … Read More
Flex Logix is a Different Kind of IP Company!
The embedded FPGA business has been getting quite a bit of press lately so it is definitely worth a closer look. Intel started it all when they acquired the #2 FPGA company Altera for $16.7B last year. Microsoft is also a big FPGA fan for search and deep learning. In fact, Microsoft’s commitment to FPGAs, specifically Altera FPGAs,… Read More
Performance Analysis for ARM Based SOC’s
ARM estimates that many SOC’s designed today have over 200 IP components. This statistic comes from a recent white paper ARM published addressing the topic of system performance analysis. This number is only going to go up. According the ARM this creates a huge challenge in ensuring the system is designed with adequate performance… Read More
Design for Fanout Packaging
In constant pursuit of improved performance, power and cost, chip and system designers always want to integrate more functions together because this minimizes inter-device loads (affecting performance and power) and bill of materials on the board (affecting cost). However it generally isn’t possible to integrate … Read More


Quantum Advantage is About the Algorithm, not the Computer