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The Interface IP Market has Grown to $530 Million!

The Interface IP Market has Grown to $530 Million!
by Eric Esteve on 10-22-2017 at 7:00 am

According with IPnest, the Interface IP market, including USB, PCI Express, (LP)DDRn, HDMI, MIPI and Ethernet IP segments, has reached $532 million in 2016, growing from $472 million in 2015. This is an impressive 13% Year-over-Year growth rate, and 12% CAGR since 2012!



Who integrate functions to interface a chip with others Read More


GLOBALFOUNDRIES RF Leadership

GLOBALFOUNDRIES RF Leadership
by Scotten Jones on 10-20-2017 at 12:00 pm

“Mobile is the largest platform ever built by humanity”, Christiano Amon, Executive Vice President, Qualcomm Technologies, Inc. and President, Qualcomm CDMA Technologies speaking at the GLOBALFOUNDRIES Technologies Conference (GTC) 2017.… Read More


IEDM 2017 Preview

IEDM 2017 Preview
by Scotten Jones on 10-20-2017 at 7:00 am

The 63rd annual IEDM (International Electron Devices Meeting) will be held December 2nd through 6th in San Francisco. In my opinion IEDM is one of, if not the premier conference on leading edge semiconductor technology. I will be attending the conference again this year and providing coverage for SemiWiki. As a member of the press… Read More


How standard-cell based eFPGA IP can offer maximum safety, flexibility and TTM?

How standard-cell based eFPGA IP can offer maximum safety, flexibility and TTM?
by Eric Esteve on 10-19-2017 at 12:00 pm

Writing a white paper is never tedious, and when the product or the technology is emerging, it can become fascinating. Like for this white paper I have written for Menta “How Standard Cell Based eFPGA IP are Offering Maximum Flexibility to New System-on-Chip Generation”. eFPGA technology is not really emerging, but it’s fascinatingRead More


How standard-cell based eFPGA IP can offer maximum safety, flexibility and TTM?

How standard-cell based eFPGA IP can offer maximum safety, flexibility and TTM?
by Eric Esteve on 10-19-2017 at 12:00 pm

Writing a white paper is never tedious, and when the product or the technology is emerging, it can become fascinating. Like for this white paper I have written for Menta “How Standard Cell Based eFPGA IP are Offering Maximum Flexibility to New System-on-Chip Generation”. eFPGA technology is not really emerging, but it’s fascinatingRead More


Accelerating Accelerators

Accelerating Accelerators
by Bernard Murphy on 10-19-2017 at 7:00 am

Accelerating compute-intensive software functions by moving them into hardware has a long history, stretching back (as far as I remember) to floating-point co-processors. Modern SoCs are stuffed with these applications, from signal processors, to graphics processors, codecs and many more functions. All of these accelerators… Read More


Rethinking IP Lifecycle Management

Rethinking IP Lifecycle Management
by Daniel Payne on 10-18-2017 at 12:00 pm

We recently saw both Apple and Samsung introduce new smart phones, and realize that the annual race to introduce sophisticated devices that are attractive and differentiated is highly competitive. If either of these companies misses a market window then fortunes can quickly change. SoCs with billions of transistors like smart… Read More


ARM TechCon 2017 Preview with Mentor!

ARM TechCon 2017 Preview with Mentor!
by Daniel Nenni on 10-18-2017 at 7:00 am

Next week is ARM TechCon which is one of my favorite conferences (SemiWiki is an event partner). This year is lucky number thirteen for ARM TechCon and it includes more than sixty hours of sessions plus more than one hundred ARM partners in the exposition. I will be signing free copies of our new book “Custom SoCs for IoT: Simplified”… Read More


Getting A Handle On Your Automotive SoCs For ISO 26262

Getting A Handle On Your Automotive SoCs For ISO 26262
by Mitch Heins on 10-17-2017 at 12:00 pm

When it comes to safety and automotive systems, ISO 26262 is the standard by which system vendors are judged. As with all things the devil is in the details. To be compliant to the standard, design teams must have a well-defined and rigorous design and validation process in place that copiously documents all the requirements of their… Read More


Reliability Signoff for FinFET Designs

Reliability Signoff for FinFET Designs
by Bernard Murphy on 10-17-2017 at 7:00 am

Ansys recently hosted a webinar on reliability signoff for FinFET-based designs, spanning thermal, EM, ESD, EMC and aging effects. I doubt you’re going to easily find a more comprehensive coverage of reliability impact and analysis solutions. If you care about reliability in FinFET designs, you might want to check out this webinar.… Read More