Vincent Cobée is a global industrial executive with more than 30 years of leadership experience, most of it spent in the highly demanding automotive industry, where he built a successful track record leading large-scale international organizations, driving business transformation, and bringing innovative technologies… Read More
When Nanomagnets Do the Math: France’s New Machine for Impossible ChoicesFrench researchers have demonstrated a hybrid nanoelectronic “Ising…Read More
Ceva’s Next-Generation NeuPro Brings a Unified AI Platform from Sensors to InfrastructureCeva is expanding the reach of its neural…Read More
ChipAgents Expands AI Across Chip Design. The Test Is Faster, Verified ResultsChipAgents is expanding its agentic AI platform across…Read More
Why Synopsys’ Role in AMD’s Instinct MI455X Matters for AI InfrastructureSynopsys’ collaboration with AMD on the Instinct MI455X…Read More
S2C Targets Faster RISC-V Bring-Up With Prototyping and AIS2C showcased FPGA prototyping and AI-assisted debugging at…Read MoreCEO Interview with Lisa Spelman of Cornelis
Lisa Spelman is CEO of Cornelis, where she leads the company’s efforts to advance high-performance networking for AI and HPC infrastructure. She brings more than 20 years of experience across AI, cloud, enterprise infrastructure, data center operations, product strategy, and go-to-market leadership.
Before joining Cornelis,… Read More
From Sequential R&D to Trusted Co-Innovation: The EPIC Model for Semiconductor Innovation
The semiconductor industry has long depended on collaboration between technology developers, equipment suppliers and manufacturers. But as artificial intelligence reshapes computing, established ways of working together may no longer be sufficient. The next wave of innovation will depend not just on what companies develop,… Read More
Strong Electronics Growth 2026
Growth in electronics production has been accelerating in 2026. Three-month-average change versus a year ago for electronics production in the U.S. was 8.1% in August 2026, continuing an accelerating growth trend since October 2025. Japan and the 27 countries of the European Union (EU 27) showed much stronger growth acceleration.… Read More
SEMICON West’s Autonomous Fab Vision Needs a Decision-Escalation Design
By Gleb Tsipursky
SEMICON West 2026’s smart-manufacturing agenda connected digital twins, agentic AI, physical AI, and increasingly autonomous factory operations. The final day included a session on automation and equipment for autonomous facilities. At its October CONNECT conference, PDF Solutions planned demonstrations… Read More
Teradyne Targets Edge AI Test Costs With UltraFLEXplus S Series
Teradyne has introduced the UltraFLEXplus S series, extending its semiconductor test platform to address the manufacturing economics of edge artificial intelligence. Announced on October 12, 2026, the series begins with the UltraFLEXplus S24, a 24-slot system intended for engineering and production testing. Its target… Read More
Beyond the Post-Mortem: How yieldHUB Live Turns the Test Floor Into an Open Window
At SEMICON West 2026 I sat down with John O’Donnell, founder and CEO, and Gillian O’Donnell, Director of Growth, to talk about how yieldHUB Live is transforming the semiconductor test floor from a blind spot into a real-time command center.
For decades, semiconductor test floors have operated as high-stakes black… Read More
Why America’s Semiconductor Manufacturing Capacity Matters
America’s semiconductor future will be shaped by its ability to turn scientific discoveries into chips manufactured at scale. That is why the investments outlined in Intel Foundry’s recent editorial matter beyond the company’s own business. They address a fundamental question: whether the United States can sustain the research,… Read More
Arteris FlexGen Opens Up Multi-Die Traffic Management for Non-Coherent Networks
Last year I wrote about Arteris’ introduction of multi-die support for coherent NoCs. This is a very big deal because hyperscalers and OEMs are now building large systems that depend on multi-chiplet architectures and require efficient traffic management between chiplets, in one case as many as 12 compute, fabric/cache and … Read More
The Industry Challenge: AI Is Forcing Semiconductor Innovation Beyond the Chip
Applied Materials President and CEO Gary Dickerson with the EPIC Center founding partners on October 12, 2026, in Sunnyvale, CA. (Tomas Ovalle/AP Content Services for Applied Materials, Inc.)The bottlenecks are becoming interconnected
Artificial intelligence is changing what the semiconductor industry must deliver. … Read More


High-NA’s Obituary Was Premature