OPC Model Accuracy and Predictability – Evolution of Lithography Process Models, Part III

OPC Model Accuracy and Predictability – Evolution of Lithography Process Models, Part III
by Beth Martin on 08-15-2011 at 7:00 am

Wyatt Earp probably wasn’t thinking of OPC when he said, “Fast is fine, but accuracy is everything,” but I’ll adopt that motto for this discussion of full-chip OPC and post-OPC verification models.

Accuracy
is the difference between the calibrated model prediction and the calibration wafer result. Accuracy depends on several… Read More


Can Your Router Handle 28 nm?

Can Your Router Handle 28 nm?
by Beth Martin on 06-20-2011 at 7:11 pm

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With the adoption of the 32/28 nm process node, some significant new challenges in digital routing arise—including complex design rule checking (DRC) and design for manufacturing (DFM) rules, increasing rule counts, very large (1 billion transistor) designs. To meet quality, time-to-market, and cost targets, design teams… Read More


Dawn at the OASIS, Dusk for GDSII

Dawn at the OASIS, Dusk for GDSII
by Beth Martin on 03-28-2011 at 1:53 pm

For an industry committed to constant innovation, changes in any part of the design flow are only slowly adopted, and only when absolutely necessary. Almost 10 years ago, it became clear that shrinking process technologies would bring a massive growth of layout and mask data—rougly 50% per node. This avalanche of data seriously… Read More


Evolution of Lithography Process Models, Part II

Evolution of Lithography Process Models, Part II
by Beth Martin on 03-24-2011 at 3:56 pm

In part I of this series, we looked at the history of lithography process models, starting in 1976. Some technologies born in that era, like the Concorde and the space shuttle, came to the end of their roads. Others did indeed grow and develop, such as the technologies for mobile computing and home entertainment. And lithography … Read More