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I earlier wrote a piece to make you aware of a webinar to be hosted by Aldec on some of their capabilities for partitioning large designs for prototyping. That webinar has now been broadcast and I have provided a link to the recorded version at the end of this piece. The webinar gets into the details of how exactly you would use the software… Read More
Although the rejection of the Lattice deal was expected, it none the less has an impact on a number of dynamics in the chip industry and further M&A and consolidation. Freezing out China removes a “catalyst” in the market which help bid up values and add fear to both potential targets or those left out. Cross border… Read More
One of the biggest surprises at the TSMC OIP Forum last week was the reappearance of bankrupt EDA vendor ATopTech. I spoke with former ATopTech CEO and now Avatar IS President Jue-Hsien Chern at OIP. As a survivor of several EDA legal battles myself, I understand what ATopTech went through and I am thoroughly impressed that they had… Read More
I often use this space to report on industry events I have attended and what I have learned at them. So, this article will be a slight, but not complete, departure from this. I am reporting on my experiences at Burning Man this year. For the unacquainted, Burning Man is a temporary city of around 70,000 people in a remote desert-like … Read More
In automotive applications, advanced FinFET processes are great for high levels of integration and low power. But they also present some new challenges in reliability signoff. Ansys will be hosting a webinar to highlight the challenges faced by engineers trying to ensure thermal, electromigration (EM) and electrostatic discharge… Read More
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The semiconductor industry has built decades of success on hyper-integration to increase functionality and performance while also reducing system cost. But the standard way to do this, to jam more and more functionality onto a single die, breaks down when some of the functions you want to integrate are built in different processes.… Read More
This year’s OIP was much more lighthearted than I remember which is understandable. TSMC is executing flawlessly, delivering new process technology every year. Last year’s opening speaker, David Keller, used the phrase “Celebrate the way we collaborate” which served as the theme for the conference. This year David’s… Read More
One of my favorite classes in college was the lab exercise, mostly because we actually got to use real electronics and then measure something, finally writing it up in our lab notebooks. The issue today is that a college student taking Electrical Engineering probably doesn’t have much access to 10nm FinFET silicon for use… Read More
Nothing is pushing complexity in system-on-chips (SoCs) designs like the drive (no pun intended) to make autonomous vehicles a widespread reality. Autonomous vehicle systems require heterogeneous architectures with reliable, efficient communications between CPU clusters, vision processing accelerators, storage and… Read More
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Should the US Government Invest in Intel?