Introducing the first ReRAM-Forum movie!! In part 2 of their recently published papers in the Transactions on Electron Devices of the IEEE, Professor Ielmini’s group describe the modeling of resistive switching in bipolar metal oxide ReRAM. Like part 1, the paper is collaboration with David Gilmer of Sematech who provided the Hafnium Oxide based ReRAM samples. The numerical model solves the drift/diffusion equations for ion migration, allowing the evolution of the conductive filament to be viewed in ‘real time’. The model reproduces the abrupt set and gradual reset transitions along with the kinetics of cell behavior observed experimentally. The reset process is shown in the embedded movie. See More at ReRAM-Forum.com.
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tsmc Defect Density and yield trends for advanced nodes and package technologies showed in 2025 Tech Symposium
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TSMC 2025 Technical Symposium Briefing
Great info. Didnt Dan or Scotten say that some/many customers do not want BSPD due to complexity/cost? Does Intel plan…— Mark Webb on April 24, 2025TSMC 2025 Technical Symposium Briefing
Intel 20A has been cancelled, though Intel did make test chips on Intel 4 process with BSPDN/PowerVIA tech enabled: https://semiwiki.com/forum/threads/with-powervia-intel-achieves-a-chipmaking-breakthrough.18226/…— Xebec on April 24, 2025TSMC 2025 Technical Symposium Briefing
Is Intel 20A the first node to adopt BSPDN? Or do they have it on earlier nodes?— Arielliu777 on April 23, 2025TSMC 2025 Technical Symposium Briefing
(Looks like Intel will be shipping chips with backside power delivery in volume 4 years before TSMC then?) Intel was…— Daniel Nenni on April 23, 2025TSMC 2025 Technical Symposium Briefing
At the conference TSMC said second half of 2026 for A16 production, not end of the year. According to Cliff…— Daniel Nenni on April 23, 2025TSMC 2025 Technical Symposium Briefing
How did you arrive at that number? TSMC hasn't changed their story of A16 production is in late 2026 so…— nghanayem on April 23, 2025TSMC 2025 Technical Symposium Briefing
A16 in 2026, but I found it interesting they are positioning backside power as an option with A14.— Fred Chen on April 23, 2025TSMC 2025 Technical Symposium Briefing
Looks like Intel will be shipping chips with backside power delivery in volume 4 years before TSMC then?— Xebec on April 23, 2025Achieving Seamless 1.6 Tbps Interoperability for High BW HPC AI/ML SoCs: A Technical Webinar with Samtec and Synopsys
Sorry that is all I could think of. 😂— Daniel Nenni on April 19, 2025
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Podcast EP278: Details of This Year’s Semiconductor Startups Contest with Silicon Catalyst’s Nick Kepler
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Podcast EP277: How Arteris FlexGen Smart NoC IP Democratizes Advanced Chip Design with Rick Bye
Podcast EP276: How Alphawave Semi is Fueling the Next Generation of AI Systems with Letizia Giuliano
TSMC 2025 Technical Symposium Briefing