Your benefits as a visitor electronica covers the entire world of electronics. Here you can find high-performance systems and components from the micro- and nano-worlds of semiconductor and micro systems technology, as well as measurement and sensor technology, display technology and vehicle electronics, from on-board power systems to active assistance systems. Because electronics is present …
About PCB Carolina Located in Raleigh (map) near Research Triangle Park makes this a prime area for this highly technical conference on electronics. There will be 16 technical sessions, a keynote address, a vendor exhibition with over 70 companies participating, food throughout the day, and best of all, this event is FREE to all attendees. This is the place to …
Montréal's End-to-End Design and Manufacturing Show Returns Advanced Design & Manufacturing Montréal brings together five advanced manufacturing areas — Design & Manufacturing, Automation Technology Expo, PACK EX, EXPOPLAST, and Powder & Bulk Solids. This all-in-one, industry-wide event lets you explore the latest trends and technologies shaping the future in advanced design and manufacturing across automation, …
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With the increasing complexity and importance of memories in modern ICs, there is a clear need for specialized tools and techniques for the design and verification of embedded memory blocks. …
With the increasing complexity and importance of memories in modern ICs, there is a clear need for specialized tools and techniques for the design and verification of embedded memory blocks. Traditional methods like SPICE simulation and cell-based formal verification have limitations; SPICE offers circuit-level accuracy but limited coverage, while cell-based methods can't fully represent transistor-level …
The TSMC Open Innovation Platform® Ecosystem Forum is a unique event that brings together the semiconductor design community and TSMC customers. The OIP Forum will feature multi-track technical presentation sessions along …
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KnowMade will be attending the SEMICON Europa 2024 Conference in Munich, where Dr. Pauline Calka will present a poster on the Leading Patent Owners & New Entrants in Advanced Packaging. …
Chiplets and Heterogenous Integration: The Next Frontier in Performance and Efficiency Innovation and Collaboration: New types of Neural Networks (Large Language Models), such as ChatGPT and other text generator, as …
Independent software vendors (ISVs) are unleashing a new wave of business innovation as they run AI directly on Intel® Core™ Ultra processors. By shifting AI workloads from the cloud to the client, businesses can lower SaaS costs, protect user privacy and data security, and enable novel use cases when AI has access to the full …
Continue reading "Webinar: Hands-On: How Financial Analysts Use AI PCs for Secure Gen AI Workloads"
GenAI + Semiconductors + Humanity: History in the Making From 5:15 until 6pm, Silicon Catalyst has arranged special access for Forum attendees only to the Museum exhibition area (ground floor) …
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While constraint-driven design is not a new concept, the demand for automation and integration between design and analysis tools has grown with increasing design complexity. Optimizing constraints with AI/ML is …
Continue reading "Webinar: AI-Driven Constraint Generation for PCB and IC Package Design"
While constraint-driven design is not a new concept, the demand for automation and integration between design and analysis tools has grown with increasing design complexity. Optimizing constraints with AI/ML is …
Continue reading "Webinar: AI-Driven Constraint Generation for PCB and IC Package Design"
