Webinar: AI-Driven Constraint Generation for PCB and IC Package Design

Online

While constraint-driven design is not a new concept, the demand for automation and integration between design and analysis tools has grown with increasing design complexity. Optimizing constraints with AI/ML is a driving force for the productivity necessary to address today’s compressed design cycles. Tight integration and complete automation are crucial to enhancing productivity and efficiency. …

Webinar: AI-Driven Constraint Generation for PCB and IC Package Design

Online

While constraint-driven design is not a new concept, the demand for automation and integration between design and analysis tools has grown with increasing design complexity. Optimizing constraints with AI/ML is a driving force for the productivity necessary to address today’s compressed design cycles. Tight integration and complete automation are crucial to enhancing productivity and efficiency. …

Supercomputing 2024 (SC24)

Georgia World Congress Center 285 Andrew Young International Blvd NW, Atlanta, GA, United States

Program Each year, SC provides the leading technical program for professionals and students in the HPC community, as measured by impact, at the highest academic and professional standards. The Program is designed to share best practices in areas such as: algorithms; applications; architectures and networks; clouds and distributed computing; data analytics, visualization, and storage; machine …

Workshop on Open-Source EDA Technology (WOSET)

Online

Workshop on Open-Source EDA Technology The WOSET workshop aims to galvanize the open-source EDA movement. The workshop will (virtually) bring together EDA researchers who are committed to open-source principles to share their experiences and coordinate efforts towards developing a reliable, fully open-source EDA flow. The workshop will feature presentations that overview existing or under-development open-source …

Automotive Computing Conferences 2024

Munich, Germany

WELCOME TO OUR AUTOMOTIVE COMPUTING CONFERENCES (ACC) in 2024 We are excited to explore the transformation of classic vehicles into modern, software-defined vehicles and IoT devices. As the automotive industry evolves, the vehicles of the future demand top-notch computing performance, powerful control units, and adherence to increasingly stringent standards. We face various challenges such as …

Defect-Based Testing

Munich, Germany

Semiconductor and integrated circuit developments continue to proceed at an incredible pace. For example, today's application-specific ICs and microprocessors can contain upwards of 100 million transistors. Traditional testing relies on …

Webinar: Accelerating Complex RF Filter Design With AI-Powered Optimization

Online

Join us for this webinar to explore how Ansys SynMatrix, powered by AI-driven automation and HFSS integration, is transforming RF filter design by streamlining workflows, optimizing performance, and accelerating time-to-market. TIME: November 19, 2024 8am PST Venue: Virtual Overview RF engineers face increasingly complex design challenges. Higher operating frequencies, stringent performance requirements, and manufacturability hurdles …

Ansys-Synopsys Technology Update: The Latest Advances in Multi-Die Design

Online

The semiconductor industry is rapidly adopting 2.5D and 3D multi-die designs as the significant benefits have become clear for applications like HPC, GPU, mobile, and AI/ML. Multi-die design technology has been quickly evolving with early experiences leading to the development of more advanced implementation and analysis techniques. For the past years, Synopsys and Ansys have …

Infineon’s GaN Roadshow

Infineon Technologies 198 Champion Court, San Jose, CA, United States

About Event Join us at the Infineon GaN Roadshow stop in San Jose to experience the future of power! This one-day symposium will dive deep into Infineon's Gallium Nitride power transistors product strategy, GaN technology roadmap, and feature comprehensive application focus tracks on GaN combined with the complete Infineon power product portfolio to design best-in-class …

TSMC EU OIP Ecosystem Forum (In-Person Event)

Hilton Amsterdam Airport Schiphol Schiphol Boulevard 701, Amsterdam, Netherlands

Learn About: Emerging advanced node design challenges and corresponding design flows and methodologies for A16, N2 and N3 processes Latest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes, InFO, CoWoS®, and SoIC, 3DFabric Alliance, and 3Dblox™ standard, plus innovative 3Dblox-based design enablement technologies and solutions, targeting HPC, AI/ML, and mobile applications Comprehensive design …